LP38512MR-ADJEV/NOPB National Semiconductor, LP38512MR-ADJEV/NOPB Datasheet
LP38512MR-ADJEV/NOPB
Specifications of LP38512MR-ADJEV/NOPB
Related parts for LP38512MR-ADJEV/NOPB
LP38512MR-ADJEV/NOPB Summary of contents
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... LP38512-ADJ provides excellent transient performance to meet the demand of high performance digital core ASICs, DSPs, and FPGAs found in highly-intensive applications such as servers, routers/switches, and base stations. Typical Application Circuit © 2009 National Semiconductor Corporation LP38512-ADJ Features ■ 2.25V to 5.5V Input Voltage Range ■ ...
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... The DAP should be soldered to the Ground Plane copper. www.national.com Package Package Type Marking PSOP-8 LP38512MR-ADJ PSOP-8 LP38512MR-ADJ TO263 THIN LP38512TJ-ADJ 30040905 PSOP 8-Pin Package 2 Supplie As Rail Tape and Reel Tape and Reel ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Storage Temperature Range Soldering Temperature (Note 3) Thin TO-263 PSOP-8 ESD Rating (Note 2) Power Dissipation (Note 4) Input Pin Voltage (Survival) Enable Pin Voltage (Survival) ...
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Symbol Parameter AC Parameters PSRR Ripple Rejection ρ Output Noise Density n(l/f) e Output Noise Voltage n Thermal Characteristics T Thermal Shutdown SD ΔT Thermal Shutdown Hysteresis T SD Thermal Resistance θ Junction to Ambient J-A (Note 4) Thermal Resistance ...
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Typical Performance Characteristics V = 2.0V µ µ OUT V vs Temperature ADJ Ground Pin Current (I GND Ground Pin Current ( Temperature GND Unless otherwise specified ...
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OUT Line Regulation vs Temperature Load Transient 1. μF Ceramic OUT ADJ OUT www.national.com EN 30040932 30040921 30040923 6 Load regulation vs Temperature 30040920 Current Limit vs ...
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Load Transient, 500 μF Ceramic V = 1.20V, C OUT OUT 30040925 Line Transient = 10 μF Ceramic V = 1.20V, C OUT OUT 30040927 PSRR 1.5A OUT = 10 μF Ceramic V ...
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Block Diagram Application Information EXTERNAL CAPACITORS Like any low-dropout regulator, external capacitors are re- quired to assure stability. These capacitors must be correctly selected for proper performance. Input Capacitor A ceramic input capacitor of at least 10 µF is required. ...
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Please refer to the POW- ER DISSIPATION/HEAT-SINKING section for power dissi- pation calculations. SETTING THE OUTPUT VOLTAGE The output voltage is set using the ...
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... JA Heat-Sinking The PSOP-8 Package The DAP of the PSOP-8 package is soldered to the copper plane for heat sinking. The LP38512MR package has a θ rating of 168°C/W, and a θ of 168°C/W includes the device DAP soldered to an area of 0.008 square inches (0. 0.09 in ounce copper on a two sided PCB, with no airflow ...
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FIGURE 4. θ vs Thermal Via Count for the PSOP-8 JA Package on 2–Layer PCB with Copper Area on Bottom- Side Figure 5 shows thermal performance for a two layer board with the DAP soldered to copper area on the ...
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Physical Dimensions TO-263 THIN, 5 Lead, Molded, 1.7mm Pitch, Surface Mount www.national.com inches (millimeters) unless otherwise noted NS Package Number TJ5A PSOP, 8-Lead, Molded, 0.050in Pitch, Surface Mount NS Package Number MRA08A 12 ...
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Notes 13 www.national.com ...
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