NCP102MBGEVB ON Semiconductor, NCP102MBGEVB Datasheet - Page 9

• Manufacturer Part Number: NCP102MBGEVB
• Description: EVAL BOARD FOR NCP102MBG
• Manufacturer: ON Semiconductor

Specifications of NCP102MBGEVB

• Design Resources: NCP102 Demo Brd BOM NCP102MBGEVB Gerber Files NCP102 EVB Schematic
• Channels Per Ic: 1 - Single
• Voltage - Output: 1.2V
• Current - Output: 3A
• Voltage - Input: 1.8V
• Regulator Type: Positive Fixed
• Board Type: Fully Populated
• Utilized Ic / Part: NCP102
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: NCP102MBG
• Other names: NCP102MBGEVBOS

PUBLICATION ORDERING INFORMATION
The products described herein (NCP102), may be covered by one or more of the following U.S. patents: 7,307,476. There may be other patents pending.
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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0.05 (0.002)
S
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
G
H
6
L
1
A
0.075
5
2
*For additional information on our Pb-Free strategy and soldering
1.9
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
3
4
0.037
0.037
0.95
0.95
D
C
B
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: [phone]
Japan Customer Focus Center
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PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 318G-02
K
ISSUE M
NCP102
TSOP-6
0.094
2.4
9
J
M
0.039
1.0
SCALE 10:1
0.028
NOTES:
0.7
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
M
A
B
C
D
G
H
K
S
J
L
inches
mm
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
0.013
MILLIMETERS
MIN
2.90
1.30
0.90
0.25
0.85
0.10
0.20
1.25
2.50
0
_
0.100
MAX
3.10
1.70
1.10
0.50
1.05
0.26
0.60
1.55
3.00
10
_
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0.0985 0.1181
0.1142 0.1220
MIN
0
INCHES
_
MAX
10
_
NCP102/D