NCP5608EVB ON Semiconductor, NCP5608EVB Datasheet - Page 4

• Manufacturer Part Number: NCP5608EVB
• Description: EVAL BOARD FOR NCP5608
• Manufacturer: ON Semiconductor

Specifications of NCP5608EVB

• Design Resources: NCP5608EVB BOM NCP5608EVB Gerber Files NCP5608EVB Schematic NCP5608 Demo Brd BOM
• Current - Output / Channel: 500mA
• Outputs And Type: 8, Non-Isolated
• Voltage - Output: 4.8 ~ 5.5 V
• Features: Brightness Control
• Voltage - Input: 3.6V
• Utilized Ic / Part: NCP5608
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: NCP5608
• Other names: NCP5608EVBOS

1. To achieve a good accuracy of the LED current, 1% tolerance resistor, with 100 ppm stability, or better, shall be used. The reference current
2. Total DC−DC output current is limited to 500 mA.
3. Ceramic X7R, ESR < 50 mW ESL < 0.5 nH, SMD types capacitors are mandatory to achieve the Iout specifications. On the other hand, care
PIN FUNCTION DESCRIPTION
Pin
is internally mirrored and sized according to the programmed value for a given external LED.
must be observed to take into account the DC bias impact on the capacitance value; see ceramic capacitor manufacturer data sheets.
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
PWRGND
Symbol
IREFBK
IREFFL
PVBAT
AGND
CCMP
VOUT
AVbat
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
SDA
SCL
C1N
C1P
C2N
C2P
C3P
C3N
OUTPUT, ANALOG
OUTPUT, ANALOG
OUTPUT, POWER
ANALOG, INPUT
INPUT, DIGITAL
INPUT, DIGITAL
INPUT, POWER
INPUT, POWER
INPUT, POWER
INPUT, POWER
INPUT, POWER
INPUT, POWER
INPUT, POWER
INPUT, POWER
INPUT, POWER
INPUT, POWER
GROUND
POWER
POWER
POWER
POWER
POWER
POWER
POWER
Type
This pin is the NCP5608 analog ground and shall be connected to the system ground. Care
must be observed to minimize the total parasitic inductance between the pin and the ground
plane.
This pin is used to set up the current reference for the FLASH output currents (LED5 to
LED8). The reference current is derived from the internal bandgap voltage to ground by
means of an external resistor. (Note 1)
This pin is used to set up the current reference for the BACK LIGHT output currents (LED1
to LED4). The reference current is derived from the internal bandgap voltage to ground by
means of an external resistor. (Note 1)
This pin, associated with the SCL signal, carries the DATA signal to set up the selected
output LED current.
The DATA signal is built with a single SDA line to support the I2C protocol.
This is the clock signal associated with the SDA pins. The pin carries the standard CLOCK
signal to operate the I2C protocol.
This pin is connected to the internal I2C bias network and must be either left open, or
bypassed to ground by a 10 nF ceramic capacitor when the I2C voltage drops below 1.8 V.
Such a capacitor compensate the voltage drop during normal operation, keeping in mind it is
not mandatory when the I2C voltage is 1.8 V and above.
This pin sinks to ground the current flowing into the first LED, and is intended to be used in
backlight application. The current is limited to 30 mA max. (Note 2)
This pin sinks to ground the current flowing into the second LED, and is intended to be used
in backlight application. The current is limited to 30 mA max. (Note 2)
This pin sinks to ground the current flowing into the third LED, and is intended to be used in
backlight application. The current is limited to 30 mA max. (Note 2)
This pin sinks to ground the current flowing into the fourth LED, and is intended to be used
in backlight application. The current is limited to 30 mA max. (Note 2)
On the other hand, LED4 can be disconnected when only three LEDs are used in the
backlight application. (Table 1)
This pin sinks to ground the current flowing into the fifth LED (100 mA max), and is intended
to be used in Flash application. (Note 2)
This pin sinks to ground the current flowing into the sixth LED (100 mA max), and is
intended to be used in Flash or high power application. (Note 2)
This pin provides the ground reference for the power elements and must be connected to
the system ground by a heavy track. Using the ground plane technique is strongly
recommended. Care must be observed to minimize the total parasitic inductance between
the pin and the ground plane.
This pin sinks to ground the current flowing into the seventh LED (100 mA max), and is
intended to be used in flash or high power application. (Note 2)
This pin sinks to ground the current flowing into the eighth LED (100 mA max), and is
intended to be used in flash or high power application. (Note 2)
This pin is the second side of the C1 fly capacitor.
This pin is the first side of the C1 fly capacitor.
This pin provides the output power to the external LED. Since the regulation is based on a
current loop, the voltage will varies as the output current varies in the application. The Vout
pin must be bypassed to GND by a 4.7 mF ceramic capacitor. (Note 3)
This pin provides the supply voltage to the charge pump converter. The pin must be
connected to the AVbat supply source and bypassed to GND by a 10 mF/16 V ceramic
capacitor. (Note 3) Using a power plane is recommended.
This pin is the second side of the C2 fly capacitor.
This pin is the first side of the C2 fly capacitor.
This pin is the second side of the C3 fly capacitor.
This pin is the first side of the C3 fly capacitor.
This pin provides the supply voltage to the analog and digitals blocks. The pin must be
connected to the PVbat supply source and bypassed to GND by a 1 mF/16 V ceramic
capacitor. (Note 3) Using a power plane is recommended.
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NCP5608
4
Description