MAX16822BEVKIT+ Maxim Integrated Products, MAX16822BEVKIT+ Datasheet - Page 3

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MAX16822BEVKIT+

Manufacturer Part Number
MAX16822BEVKIT+
Description
KIT EVAL FOR MAX16822
Manufacturer
Maxim Integrated Products
Datasheets

Specifications of MAX16822BEVKIT+

Current - Output / Channel
350mA
Outputs And Type
1, Non-Isolated
Voltage - Output
64V
Features
Dimmable
Voltage - Input
6 ~ 65V
Utilized Ic / Part
MAX16822
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
The MAX16822B EV kit features a jumper to enable and
disable the MAX16822B IC (U1). Installing jumper JU1
disables the MAX16822B IC. Additionally, HBLED dim-
ming is achieved on the MAX16822B EV kit by applying
a digital PWM signal at the DIM PCB input pad.
Remove the shunt at jumper JU1 to enable HBLED dim-
ming using a digital PWM signal at the DIM and PGND
PCB pads. Apply a digital PWM signal with a 0.6V
logic-low (or less) and a 2.8V logic-high (or more) level
and frequencies from 200Hz to 20kHz. To adjust the
HBLED brightness, vary the signal duty cycle from 0 to
100%. See Table 1 for jumper JU1 setting of the HBLED
dimming operation.
Table 1. Enable and HBLED Dimming
(Jumper JU1)
* Analog dimming is achieved by placing a resistor (RDIM)
across the TEMP_I and PGND PCB pads. Remove the shunt
across jumpers JU1 and JU2 and use the following equation to
calculate the current for the TEMP_I PCB pad resistor, which is
necessary to reduce the HBLED driving current. Refer to the
Analog Dimming section in the MAX16822A/MAX16822B IC
data sheet for information on the analog dimming feature.
where RDIM is the TEMP_I pad resistor, ILED DIM is the
required current for the desired HBLED current, and ILED is
configured for 322mA.
Alternatively, installing jumper JU2 and adjusting potentiometer
R2 can simulate analog dimming. Or, for DC control analog
dimming, install jumper JU2 and apply a DC voltage in the
0.7V to 2V range at the TP1 (positive) and TP2 (PGND) test
points.
POSITION
installed
installed
Installed
SHUNT
Not
Not
ILED DIM = ILED [1 - 0.75 x (2 - (RDIM x 26.5µA))]
Enable and HBLED Dimming Control
Connected to PGND
Connected to PWM
through resistor R4
Connected to VIN
_______________________________________________________________________________________
DIM PIN
signal
applied at DIM PCB pad
DIMMING OPERATION
Enabled, PWM signal
EV KIT ENABLE OR
Enabled or analog
(see Table 2)
dimming*
Disabled
MAX16822B Evaluation Kit
The MAX16822B EV kit features a thermal foldback and
temperature simulation circuit available at the TEMP_I
PCB pad and jumper JU2. Jumper JU2 sets the mode
of operation, temperature simulation, or thermal fold-
back. Potentiometer R2 and resistor R3 form the
adjustable temperature simulation circuit. Test points
TP1 and TP2 (PGND) provide access to the signal for
adjusting the voltage.
To evaluate the MAX16822B IC thermal foldback fea-
ture, remove jumper JU2 and connect an NTC thermis-
tor to the TEMP_I and PGND PCB pads. Refer to the
Thermal Foldback section in the MAX16822A/
MAX16822B IC data sheet for information on using the
thermal foldback feature. See Table 2 for configuring
jumper JU2 for the desired mode of operation.
Resistor R1 sets the MAX16822B EV kit average
HBLED current up to 333mA. However, the HBLED
average current can be set up to 350mA after replacing
resistor R1. Use the following equation to calculate R1
when reconfiguring the HBLED current:
where I
Refer to the Selecting R
tion in the MAX16822A/MAX16822B IC data sheet for
information on setting the HBLED current.
Table 2. Temperature Simulation and
Thermal Foldback (Jumper JU2)
POSITION
Installed
installed
SHUNT
Not
LED
C onnected to R2 and R3 Temperature simulation
is the desired HBLED average current.
Connected to external
Setting External HBLED Current
NTC thermistor
TEMP_I PIN
R
Temperature Simulation
SENSE
1
=
Thermal Foldback and
0 2
I
LED
.
to Set LED Current sec-
V
EV KIT OPERATION
Thermal foldback
3

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