LM3508TLEV National Semiconductor, LM3508TLEV Datasheet - Page 4

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LM3508TLEV

Manufacturer Part Number
LM3508TLEV
Description
BOARD EVALUATION FOR LM3508TL
Manufacturer
National Semiconductor
Series
PowerWise®r
Datasheets

Specifications of LM3508TLEV

Current - Output / Channel
20mA
Outputs And Type
1, Non-Isolated
Voltage - Output
17V
Features
Dimmable
Voltage - Input
2.7 ~ 5.5V
Utilized Ic / Part
LM3508
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
www.national.com
I
I
R
I
I
t
EN
OUT
Q
Q_SW
START_UP
OUT_SHUTDOWN
Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended
to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: All voltages are with respect to PGND.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown enagaes at T
T
Note 4: For more detailed soldering information and specifications, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer Level Chip
Scale Package (AN-1112), available at www.national.com.
Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
dissipation of the device in the application (P
following equation: T
Note 6: Junction-to-ambient thermal resistance (θ
standard JESD51-7. The test board is a 4-layer FR-4 board mesuring (102mm × 76mm × 1.6mm) with a 2 × 1 array of thermal vias. The ground plane on the
board is (50mm × 50mm). Thickness of copper layers are (36µm/18µm/18µm/36µm) (1.5oz/1oz/1oz/1.5oz copper). Ambient temperature in simulation is +22°C,
still air. Power dissipation is 1W.
Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Unless otherwise specified, conditions for typical specifications are V
Note 8: There is a typical 383kΩ pull-down on this pin.
Note 9: The human body model is a 100pF capacitor discharged through 1.5kΩ resistor into each pin. (MIL-STD-883 3015.7).
Typical Performance Characteristics
LEDs are OSRAM (LW M67C), C
J
= +140°C (typ.).
Symbol
(L = TDK VLF3012AT-220MR33, R
A-MAX
4 LED Efficiency vs I
= T
J-MAX-OP
EN Bias Current
(Note 8)
OUT Bias Current
Output Pull-Down
Resistance in
Shutdown
Quiescent Current
Device Not Switching
Switching Supply
Current
From EN Low to High
to Inductor Current
Steady State
Parameter
– (θ
OUT
JA
A-MAX
× P
D-MAX
= C
D-MAX
) is dependent on the maximum operating junction temperature (T
), and the junction-to ambient thermal resistance of the part/package in the application (θ
JA
IN
LED
) is taken from thermal modeling performed under the conditions and guidelines set forth in the JEDEC
).
= 1µF, T
L
= 0.66Ω)
V
V
switching
V
V
5.5V, SW Floating
V
V
EN
OUT
EN
ILED
EN
OUT
30004242
= 0V, 3.0V < V
= 1.8V
= 0V, V
A
= 16V, device not
= 17V, I
> 0.5V, 3.0V < V
= +25°C, unless otherwise noted.
Conditions
IN
= 3.6V, T
OUT
LED
< V
4
V
= 20mA
A
IN
IN
= +25°C.
IN
< 5.5V
= 3.6V, R
IN
<
(L = TDK VLF3012AT-220MR33, R
SET
Min
= 10Ω, L = TDK VLF3012AT-220MR33 (22µH),
3 LED Efficiency vs I
J-MAX-OP
0.18
0.01
Typ
420
630
825
470
4.7
J
= +125ºC), the maximum power
= +150°C (typ.) and disengages at
LED
Max
L
0.3
0.5
= 0.66Ω)
JA
), as given by the
30004241
Units
mA
µA
µA
µA
µs

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