NCP3065D1SLDGEVB ON Semiconductor, NCP3065D1SLDGEVB Datasheet - Page 16

• Manufacturer Part Number: NCP3065D1SLDGEVB
• Description: EVAL BOARD FOR NCP3065D1SLDG
• Manufacturer: ON Semiconductor

Specifications of NCP3065D1SLDGEVB

• Design Resources: NCP3065D1SLDGEVB BOM NCP3065D1SLDGEVB Gerber Files NCP3065D1SLDGEVB Schematic
• Current - Output / Channel: 350mA
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 14.4V
• Voltage - Input: 12V
• Utilized Ic / Part: NCP3065
• Core Chip: NCP3065
• Topology: SEPIC
• No. Of Outputs: 1
• Development Tool Type: Hardware - Eval/Demo Board
• Leaded Process Compatible: Yes
• Mcu Supported Families: NCP3065
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: NCP3065D1SLDG
• Other names: NCP3065D1SLDGEVBOS

NOTE 2
SEATING
PLANE
−T−
H
8
1
F
−A−
G
5
0.13 (0.005)
4
D
N
−B−
C
M
K
T
A
M
PACKAGE DIMENSIONS
B
http://onsemi.com
M
CASE 626−05
8 LEAD PDIP
ISSUE L
16
L
M
J
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
3. DIMENSIONING AND TOLERANCING PER ANSI
FORMED PARALLEL.
SQUARE CORNERS).
Y14.5M, 1982.
STYLE 1:
DIM
G
M
A
B
C
D
F
H
J
K
L
N
PIN 1. AC IN
2. DC + IN
3. DC - IN
4. AC IN
5. GROUND
6. OUTPUT
7. AUXILIARY
8. V
MILLIMETERS
MIN
9.40
6.10
3.94
0.38
1.02
0.76
0.20
2.92
0.76
---
2.54 BSC
7.62 BSC
CC
10.16
MAX
6.60
4.45
0.51
1.78
1.27
0.30
3.43
1.01
10
_
0.370
0.240
0.155
0.015
0.040
0.030
0.008
0.115
0.030
MIN
---
0.100 BSC
0.300 BSC
INCHES
0.400
0.260
0.175
0.020
0.070
0.050
0.012
0.135
0.040
MAX
10
_