KIT33701DWBEVB Freescale Semiconductor, KIT33701DWBEVB Datasheet - Page 6

• Manufacturer Part Number: KIT33701DWBEVB
• Description: KIT FOR 33701 POWER SUPPLY
• Manufacturer: Freescale Semiconductor
• Type: LDO Controllers & Regulatorsr

Specifications of KIT33701DWBEVB

• Main Purpose: DC/DC, Step Down with LDO
• Outputs And Type: 2, Non-Isolated
• Voltage - Input: 2.8 ~ 6V
• Regulator Topology: Buck
• Frequency - Switching: 300kHz
• Board Type: Fully Populated
• Utilized Ic / Part: MC34701
• Product: Power Management Modules
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Voltage - Output: -
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: 34701

Table 2.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
6
34701
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RATINGS
Notes
Storage Temperature
Peak Package Reflow Temperature During Reflow
Maximum Junction Temperature
Thermal Resistance
Thermal Resistance, Junction to Base
Operational Package Temperature (Ambient Temperature)
2.
3.
4.
5.
6.
Junction to Ambient (Single Layer)
Junction to Ambient (Four Layers)
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s package reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.
Per JEDEC JESD51-6 with the board horizontal
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
Maximum Ratings (continued)
Rating
(4)
(4)
(6)
,
,
(5)
(5)
(2)
,
(3)
Symbol
T
T
T
R
R
JMAX
PPRT
STG
T
θJA
θJB
A
Analog Integrated Circuit Device Data
-65 to 150
-40 to 85
Value
Note 3
125
70
55
18
Freescale Semiconductor
°C/W
°C/W
Unit
°C
°C
°C
°C