IRDC3629A International Rectifier, IRDC3629A Datasheet - Page 14
IRDC3629A
Manufacturer Part Number
IRDC3629A
Description
BOARD EVAL SYNC BUCK CONTROLLER
Manufacturer
International Rectifier
IRDC3629A
Solder Resist
The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist mis-
alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder Mask Defined
(NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
The minimum solder resist width is 0.13mm.
At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a fillet so a
solder resist width of ≥ 0.17mm remains.
The land pad should be Non Solder Mask Defined (NSMD), with a minimum pullback of the solder resist off the
copper of 0.06mm to accommodate solder resist mis-alignment.
Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of
the solder resist strip separating the lead lands from the pad land.
Each via in the land pad should be tented or plugged from bottom boardside with solder resist.
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