LM4892MBD National Semiconductor, LM4892MBD Datasheet - Page 18

• Manufacturer Part Number: LM4892MBD
• Description: BOARD EVALUATION LM4892M
• Manufacturer: National Semiconductor
• Series: Boomer®r

Specifications of LM4892MBD

• Amplifier Type: Class AB
• Output Type: 1-Channel (Mono) with Mono Headphones
• Max Output Power X Channels @ Load: 1W x 1 @ 8 Ohm; 90mW x 1 @ 32 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Board Type: Fully Populated
• Utilized Ic / Part: LM4892
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

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Application Information
PCB LAYOUT GUIDELINES
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
’rule-of-thumb’ recommendations and the actual results will
depend heavily on the final layout.
General Mixed Signal Layout Recommendation
Power and Ground Circuits
For 2 layer mixed signal design, it is important to isolate the
digital power and ground trace paths from the analog power
and ground trace paths. Star trace routing techniques (bring-
ing individual traces back to a central point rather than daisy
chaining traces together in a serial manner) can have a
major impact on low level signal performance. Star trace
routing refers to using individual traces to feed power and
ground to each circuit or even device. This technique will
require a greater amount of design time but will not increase
the final price of the board. The only extra parts required will
be some jumpers.
Part Description
LM4892 Audio Amplifier
Tantalum Capacitor, 1µF
Ceramic Capacitor, 0.39µF
Capacitor, 100µF
Resistor, 1kΩ, 1/10W
Resistor, 20kΩ, 1/10W
Resistor, 100kΩ, 1/10W
Jumper Header Vertical Mount 2X1,
0.100’ spacing
3.5mm Audio Jack (PC mount, w/o nut),
PN # SJS-0357-B Shogyo International
Corp. (www.shogyo.com)
Mono LM4892 Reference Design Boards
(Continued)
Bill of Material for all Demo Boards
18
Qty
1
2
1
1
1
3
2
1
1
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital
traces through a single point (link). A ’Pi-filter’ can be helpful
in minimizing High Frequency noise coupling between the
analog and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digi-
tal and analog ground traces to minimize noise coupling.
Placement of Digital and Analog Components
All digital components and high-speed digital signal traces
should be located as far away as possible from analog
components and circuit traces.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces
parallel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each
other from the top to the bottom side as much as possible will
minimize capacitive noise coupling and cross talk.
Ref Designator
U1
Cs, Cb
Ci
Cout
Rpd
Ri, Rf, Rpu2
Rpu1, Rs
J1
J2