AD9262-10EBZ Analog Devices Inc, AD9262-10EBZ Datasheet - Page 8

• Manufacturer Part Number: AD9262-10EBZ
• Description: BOARD EVALUATION 10MHZ AD9262
• Manufacturer: Analog Devices Inc

Specifications of AD9262-10EBZ

• Design Resources: Interfacing ADL5382 to AD9262 as an RF-to-Bits Solution (CN0062)
• Number Of Adc's: 2
• Number Of Bits: 16
• Sampling Rate (per Second): 160M
• Data Interface: Serial, SPI™
• Inputs Per Adc: 1 Differential
• Input Range: 2 Vpp
• Power (typ) @ Conditions: 600mW @ 40MSPS
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9262
• Silicon Manufacturer: Analog Devices
• Application Sub Type: ADC
• Kit Application Type: Data Converter
• Silicon Core Number: AD9262
• Kit Contents: Software, Evaluation Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9262
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
Environmental
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AVDD to AGND
DVDD to DGND
DRVDD to DGND
AGND to DGND
AVDD to DRVDD
CVDD to CGND
CGND to DGND
D0A to D15A to DGND
D0B to D15B to DGND
DCO to DGND
ORA, ORB to DGND
SDIO to DGND
CSB to AGND
SCLK to AGND
VIN+A/VIN−A, VIN+B/VIN−B to AGND
CLK+, CLK− to CGND
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 Sec)
Junction Temperature
Rating
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−0.3 V to +3.9 V
−40°C to +85°C
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−3.9 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +2.5 V
−0.3 V to +2.0 V
−65°C to +125°C
300°C
150°C
Rev. A | Page 8 of 32
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 7. Thermal Resistance
Package Type
64-Lead LFCSP (CP-64-4)
Typical θ
Airflow increases heat dissipation, effectively reducing θ
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θ
ESD CAUTION
JA
.
JA
and θ
JC
are specified for a 4-layer board in still air.
θ
21.2
JA
θ
1.1
JC
Unit
°C/W
JA
. In