AD9248BCP-20EBZ Analog Devices Inc, AD9248BCP-20EBZ Datasheet - Page 45

• Manufacturer Part Number: AD9248BCP-20EBZ
• Description: BOARD EVAL WITH AD9248BCP-20
• Manufacturer: Analog Devices Inc

Specifications of AD9248BCP-20EBZ

• Number Of Adc's: 2
• Number Of Bits: 14
• Sampling Rate (per Second): 20M
• Data Interface: Parallel
• Inputs Per Adc: 1 Differential
• Input Range: 2 Vpp
• Power (typ) @ Conditions: 190mW @ 20MSPS
• Voltage Supply Source: Single
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9248BCP-20
• Silicon Manufacturer: Analog Devices
• Application Sub Type: ADC
• Silicon Core Number: AD9248
• Kit Contents: Board
• Power Dissipation Pd: 217mW
• Termination Type: SMD
• Sample Rate: 20 MSPS
• No. Of Pins: 64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9248
Figure 58. PCB Bottom-Side Silkscreen
THERMAL CONSIDERATIONS
The AD9248 LFCSP has an integrated heat slug
that improves the thermal and electrical properties of the
package when locally attached to a ground plane at the PCB.
A thermal (filled) via array to a ground plane beneath the
part provides a path for heat to escape the package, lowering
junction temperature. Improved electrical performance
also results from the reduction in package parasitics due to
proximity of the ground plane. Recommended array is 0.3 mm
vias on 1.2 mm pitch. θ
= 26.4°C/W with this recommended
JA
configuration. Soldering the slug to the PCB is a requirement
for this package.
Figure 59. Thermal Via Array
Rev. B | Page 45 of 48