MAX11040DBEVKIT+ Maxim Integrated Products, MAX11040DBEVKIT+ Datasheet - Page 9

• Manufacturer Part Number: MAX11040DBEVKIT+
• Description: KIT EVALUATION FOR MAX11040
• Manufacturer: Maxim Integrated Products

Specifications of MAX11040DBEVKIT+

• Silicon Manufacturer: Maxim
• Silicon Core Number: MAX11040
• Kit Application Type: Data Converter
• Application Sub Type: ADC
• Kit Contents: Eval. Board, USB Cable, Daughter Board
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Carefully connect the boards by aligning the EV kit’s
14-pin connector (J12) with the 14-pin header (J1) of
the daughterboard. Gently press them together. The
two boards should be flush against each other. If more
daughterboards need to be cascaded to the EV kit,
connect the 14-pin connector (J2) of the last daughter-
board with the 14-pin header (J1) of the additional
daughterboard.
Place the shunt on pins 2-3 of JU3 on the last daughter-
board (the one farthest away from the EV kit board),
and place the shunt on pins 1-2 of JU3 on all other
boards (including the EV kit board).
Two separate power supplies are required to power up
the daughterboard. Connect the analog voltage supply
(from +3V to +3.6V) and the analog ground to the
Table 2. Jumper Settings (Daughterboard)
JUMPER
JU1
JU2
JU3
JU4
POSITION
SHUNT
MAX11040 Evaluation Kit/Daughterboard
Open*
Open*
2-3*
1-2*
_______________________________________________________________________________________
1-2
1-2
1-2
2-3
Connects the on-board crystal (Y1) to the crystal
oscillator input and output of the IC (U1)
Disconnects the on-board crystal from the IC
(U1)
Connects the XOUT pin of the IC (U1) to the
EX_XOUT pad
Disconnects the EX_XOUT pad from the XOUT
pin of the IC (U1)
C onnects the DRD Y O UT p i n of the IC ( U 1) to the
C O_D RD Y OU T p i n on the connector ( J2)
Connects the DRDYOUT pin of the IC (U1) to the
interrupt pin (INT0) of the on-board controller
Connects the XIN pin of the IC (U1) to the CI_XIN
pin on the J1 connector
Note: CI_XIN carries the CLKOUT signal from the
previous cascaded board
Connects the XIN pin of the IC (U1) to the
EX_XIN pad
Note: User-supplied external crystal may be
connected to the IC (U1) through the EX_XIN and
the EX_XOUT pads
Power Supply
DESCRIPTION
Cascade
AVDD and AGND connectors, respectively. Connect
the digital voltage supply (from +2.7V to AVDD) and the
digital ground to the DVDD and DGND connectors on
the daughterboard, respectively.
There are four LED indicators (D1–D4) on the daughter-
board. D1 and D2 LEDs reflect the real-time logic levels
on the FAULT and the OVRFLW pins, respectively. D3
and D4 LEDs latch on the fault conditions on the FAULT
and the OVRFLW pins, respectively. When D3 or D4 is
turned on, press the Clear LED button in the EV kit soft-
ware (Figure 1) or press the on-board pushbutton (S2)
to turn off the LEDs after the faults are cleared. All IC
FAULT and OVERFLW pins are open drain and respec-
tively connected in a wired-ORed configuration.
When the user wishes to stimulate the IC
modulator clock by the on-board crystal (Y1)
When the user does not wish to stimulate the IC
(U1) modulator clock by the on-board crystal
(Y1)
When the user-supplied external crystal
connects to the IC (U1) through the EX_XIN and
the EX_XOUT pads
When an external crystal is not used
Use this option when more IC daughterboards
need to be cascaded
Use this option on the last IC daughterboard that
cascades to the IC EV kit
When the user wishes to stimulate the IC (U1)
modulator clock by the CLKOUT of the previous
cascaded board
When the user does not wish to stimulate the IC
(U1) modulator clock by the CLKOUT of the
previous cascaded board
WHEN TO USE THIS OPTION
LEDs
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