MAX4951EVKIT+ Maxim Integrated Products, MAX4951EVKIT+ Datasheet - Page 7

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MAX4951EVKIT+

Manufacturer Part Number
MAX4951EVKIT+
Description
EVAL KIT FOR MAX4951
Manufacturer
Maxim Integrated Products
Datasheets

Specifications of MAX4951EVKIT+

Main Purpose
Interface, Buffer, SATA
Utilized Ic / Part
MAX4951
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Secondary Attributes
-
Embedded
-
Primary Attributes
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
The exposed-pad, 20-pin, TQFN package incorporates
features that provide a very low thermal-resistance path
for heat removal from the IC. The exposed pad on the
MAX4951 must be soldered to GND for proper thermal
and electrical performance. For more information on
exposed-pad packages, refer to Maxim Application
Note HFAN-08.1: Thermal Considerations of QFN and
Other Exposed-Paddle Packages .
Use controlled-impedance transmission lines to inter-
face with the MAX4951 high-speed inputs and outputs.
_______________________________________________________________________________________
SATA I/SATA II Bidirectional Re-Driver
Exposed-Pad Package
X = Don’t Care
EN
0
1
1
1
1
BA
HAM
HBM
HAP
HBP
X
0
1
0
1
BB
X
0
0
1
1
50Ω
50Ω
Layout
GND
V
V
Standard SATA
Standard SATA
CC
CC
CHANNEL A
CONTROL LOGIC
Standby
BA
MAX4951
Boost
Boost
MAX4951
50Ω
50Ω
V
BB
CC
50Ω
50Ω
EN
Place power-supply decoupling capacitors as close as
possible to V
As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electro-
static discharges encountered during handling and
assembly. The MAX4951 is protected against ESD up
to ±5.5kV (Human Body Model) without damage. The
ESD structures withstand ±5.5kV in all states: normal
operation and powered down. After an ESD event, the
MAX4951 continues to function without latchup.
V
V
CC
CC
Functional Diagram/Truth Table
50Ω
50Ω
Standard SATA
Standard SATA
CHANNEL B
Standby
CC
Boost
Boost
DAP
DAM
DBM
DBP
.
ESD Protection
7

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