LMX25120967EVAL/NOPB National Semiconductor, LMX25120967EVAL/NOPB Datasheet - Page 8

EVALUATION BOARD FOR LMX25120967

LMX25120967EVAL/NOPB

Manufacturer Part Number
LMX25120967EVAL/NOPB
Description
EVALUATION BOARD FOR LMX25120967
Manufacturer
National Semiconductor
Series
PLLatinum™r

Specifications of LMX25120967EVAL/NOPB

Main Purpose
Timing, Frequency Synthesizer
Embedded
No
Utilized Ic / Part
LMX2512
Primary Attributes
Single Fractional-N and Integer-N PLL with VCO
Secondary Attributes
967MHz, CodeLoader Graphical User Interface
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*LMX25120967EVAL
*LMX25120967EVAL/NOPB
LMX25120967EVAL
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Japan
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Email:
Phone:
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1 800 272 9959
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Packaging Solutions
For samples, evaluation boards, datasheets, and online design tools,
visit:
Packaging
Many design qualities are required for effective portable devices, and
one of the most important is packaging. National’s leadership in small
form factor packaging covers Die and Wafer Scale packaging to the
technologically advanced LLP packaging. For more information, visit
www.national.com/packaging
For More Information
National Semiconductor provides a comprehensive set of support
services. Product information, including sales literature and technical
assistance, is available through National’s Customer Support Centers.
As small as - 6.4 mm x 5.0 mm x 1.1 mm
As small as - 4.0 mm
Leadless Leadframe
x 4.0 mm x 0.75 mm
Thin Shrink Small Outline Package
Package (LLP
wireless.national.com
(TSSOP)
®
)
National’s LLP
capability in a very small package footprint. Unlike
conventional leaded plastic packages, the LLP contains
pads on the bottom of the package for PCB mounting.
© National Semiconductor Corporation, April 2006. National Semiconductor,
and Analog University are registered trademarks of National Semiconductor Corporation. All rights reserved.
®
provides excellent power dissipation
As small as - 3.5 mm x 3.5 mm x 0.6 mm
Chip Scale Packaging
(CSP, TCSP, UTCSP)
, LLP, WEBENCH, PLLatinum,
550240-014

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