LMX2430EVAL National Semiconductor, LMX2430EVAL Datasheet - Page 8
![no-image](/images/manufacturer_photos/0/4/469/national_semiconductor_sml.jpg)
LMX2430EVAL
Manufacturer Part Number
LMX2430EVAL
Description
EVALUATION BOARD FOR LMX2430
Manufacturer
National Semiconductor
Series
PLLatinum™r
Datasheets
1.LMX2433SLEXNOPB.pdf
(49 pages)
2.LMX2430EVAL.pdf
(26 pages)
3.LMX2430EVAL.pdf
(8 pages)
Specifications of LMX2430EVAL
Main Purpose
Timing, Frequency Synthesizer
Utilized Ic / Part
LMX2430
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Secondary Attributes
-
Embedded
-
Primary Attributes
-
Lead Free Status / Rohs Status
Not Compliant
Other names
*LMX2430EVAL
Americas
Email:
Phone:
Europe
Fax:
Email:
Phone:
Asia Pacific
Email:
Japan
Fax:
Email:
Phone:
National Semiconductor
2900 Semiconductor Drive
PO Box 58090
Santa Clara, CA 95052
1 800 272 9959
Visit our website at:
www.national.com
For more information,
send email to:
new.feedback@nsc.com
new.feedback@nsc.com
1-800-272-9959
+49 (0) 180-530 85 86
europe.support@nsc.com
Deutsch + 49 (0) 69 9508 6208
English
Français + 33 (0) 1 41 91 87 90
ap.support@nsc.com
81-3-5639-7507
jpn.feedback@nsc.com
81-3-5639-7560
+ 44 (0) 870 24 0 2171
Packaging Solutions
For samples, evaluation boards, datasheets, and online design tools,
visit:
Packaging
Many design qualities are required for effective portable devices, and
one of the most important is packaging. National’s leadership in small
form factor packaging covers Die and Wafer Scale packaging to the
technologically advanced LLP packaging. For more information, visit
www.national.com/packaging
For More Information
National Semiconductor provides a comprehensive set of support
services. Product information, including sales literature and technical
assistance, is available through National’s Customer Support Centers.
As small as - 6.4 mm x 5.0 mm x 1.1 mm
As small as - 4.0 mm
Leadless Leadframe
x 4.0 mm x 0.75 mm
Thin Shrink Small Outline Package
Package (LLP
wireless.national.com
(TSSOP)
®
)
National’s LLP
capability in a very small package footprint. Unlike
conventional leaded plastic packages, the LLP contains
pads on the bottom of the package for PCB mounting.
© National Semiconductor Corporation, April 2006. National Semiconductor,
and Analog University are registered trademarks of National Semiconductor Corporation. All rights reserved.
®
provides excellent power dissipation
As small as - 3.5 mm x 3.5 mm x 0.6 mm
Chip Scale Packaging
(CSP, TCSP, UTCSP)
, LLP, WEBENCH, PLLatinum,
550240-014