74LVC2G66EVB NXP Semiconductors, 74LVC2G66EVB Datasheet - Page 4
![BOARD EVALUATION FOR 74LVC2G66](/photos/9/7/90793/74lvc2g66evb_sml.jpg)
74LVC2G66EVB
Manufacturer Part Number
74LVC2G66EVB
Description
BOARD EVALUATION FOR 74LVC2G66
Manufacturer
NXP Semiconductors
Specifications of 74LVC2G66EVB
Main Purpose
Interface, Analog Switch
Embedded
No
Utilized Ic / Part
74LVC2G66
Primary Attributes
Dual SPST Analog Switch
Secondary Attributes
1.65 ~ 5.5 V Supply
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5081
Packages
The 74LVC2G66 is available in leadless 8-pin XSON, XSONU, and XQFN packages and in standard 8-pin TSSOP and VSSOP
packages.
Ordering information
www.nxp.com
© 2010 NXP B.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and
may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof
does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Package suffix
Width (mm)
Length (mm)
Height (mm)
Pitch (mm)
Part number
74LVC2G66DP
74LVC2G66GD
74LVC2G66DC
74LVC2G66GT
74LVC2G66GM
-40 to 125 °C
-40 to 125 °C
-40 to 125 °C
-40 to 125 °C
-40 to 125 °C
Temp. range
SOT505-2
8-pin
0.65
DP
1.1
3
3
XSON8U
XQFN8U
TSSOP8
VSSOP8
XSON8
Name
SOT996-2
8-pin
GD
0.5
0.5
2
3
Extremely thin quad flat package; no leads
Extremely thin small outline package;
Very thin shrink small outline package
Extremely thin small outline package;
Thin shrink small outline package
SOT833-1
Package
8-pin
1.05
no leads
no leads
GT
0.5
0.5
Type
2
Date of release: August 2010
Document order number: 9397 750 16981
Printed in the Netherlands
SOT902-1
8-pin
1.65
1.65
GM
0.5
0.5
Marking
V66
V66
V66
V66
V66
SOT765-1
8-pin
DC
2.3
0.5
Material
2
1
Plastic
Plastic
Plastic
Plastic
Plastic