ATA6826-DK Atmel, ATA6826-DK Datasheet - Page 13

• Manufacturer Part Number: ATA6826-DK
• Description: BOARD EVALUATION FOR ATA6826
• Manufacturer: Atmel

Specifications of ATA6826-DK

• Main Purpose: Power Management, Half H-Bridge Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: ATA6826
• Primary Attributes: 3 Half H-Bridge Drivers, 1A, 2 kV ESD Protection
• Secondary Attributes: Short-Circuit, Thermal & Undervoltage Protection
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

5. Thermal Considerations
5.1
4981A–AUTO–02/07
Cooling Area Design
The IC should be connected to a cooling area onboard. All thermal pins (4 GND pins) are
directly connected to the cooling area.
housing of the ATA6826. The cooling area extension should be increased or decreased accord-
ing to the required power dissipation (see
as follows: 2 × L² = cooling area extension [mm²].
The effect of the cooling area on the PCB can be further improved if the bottom side of the PCB
is ground-plated and thermal vias are placed along the cooling area. A via diameter of 0.3 mm to
0.4 mm and a spacing of 1 mm to 1.5 mm has proven to be most suitable. Some care should be
taken of the copper area's planarity; it should especially be avoided that any solder bumps arise
at the thermal vias.
Figure 5-1.
Figure 5-2.
Recommended Cooling Area Extension
Thermal Resistance Versus Adapted Cooling-area Size on Board
40.0
30.0
70.0
65.0
60.0
50.0
45.0
35.0
25.0
20.0
55.0
0.0
5.0
10.0
Figure 5-1
Figure
15.0
L (mm)
shows the cooling arrangement with the SO14
5-2). The cooling area extension is calculated
20.0
25.0
30.0
L
35.0
40.0
ATA6826
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