DM163025 Microchip Technology, DM163025 Datasheet - Page 101

• Manufacturer Part Number: DM163025
• Description: PIC DEM FULL SPEED USB DEMO BRD
• Manufacturer: Microchip Technology

Specifications of DM163025

• Main Purpose: Interface, USB 2.0 Host/Controller
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: PIC18F2455/2550/4455/4550
• Primary Attributes: Full Speed (12Mbps)
• Secondary Attributes: MPLAB ICE 2000/4000 Emulator Interface, Temp Sensor, Expansion and PICtail Headers
• Processor To Be Evaluated: PIC18F4550
• Interface Type: RS-232, USB
• Silicon Manufacturer: Microchip
• Core Architecture: PIC
• Core Sub-architecture: PIC18
• Silicon Core Number: PIC18F
• Silicon Family Name: PIC18F4xxx
• Kit Contents: Demo Board, Cables, CD & Documents
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: Q2086254

Ordering Information for all Microchip PICmicro®, K
XXXXXXXXXX - XX X/XX XXX
QTP, SQTP or ROM Code; Special Requirements
Package:
1M
3M
7M
CB
CL
G
JW
L
LQ
MC
MF
ML
MM
MS
OT
P
PF
PQ
PT
Process Temperature:
Blank = 0°C to +70°C
I (Industrial) = -40°C to +85°C
E (Extended = -40°C to +125°C
Speed:
-90
-10
-12
-15
-17
-20
-25
-30
Option:
T = Tape and Reel Shipments
X = Rotated pinout
Device Type: (Up to 10 digits)
AA
C
C
CE
CR
F
FC
HC
HV
LC
LC
Note:
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1000pF COB Module
330pF COB Module
2x68pF COB Module (IOA2)
Chip on Board (COB)
Windowed CERQUAD
Lead Free
Windowed CERDIP
Plastic Leaded Chip Carrier (PLCC)
Plastic Low Quad Flatpack (LQFP)
Dual Flat-No Leads (DFN) 2x3
Dual Flat - No Leads (DFN)
Quad Flat - No Leads (QFN)
Quad Flat - No Leads (DFN)
Micro Small Outline (MSOP)
5-Lead or 6-Lead SOT-23
Plastic DIP
Plastic Thin Quad Flatpack
(TQFP 14x14)
Plastic Quad Flatpack (PQFP)
Plastic Thin Quad Flatpack (TQFP)
90 ns
100 ns
120 ns
150 ns
170 ns
200 ns or 20 MIPS
250 ns or 30 MIPS
300 ns
1.8V Serial EEPROM
CMOS EPROM/ROMless MCU
5V Serial EEPROM
CMOS EPROM/EEPROM MCU
CMOS ROM MCU
Flash MCU
High Speed serial EEPROM
High Speed
High Voltage
Low Voltage CMOS EPROM MCU
Low Voltage (2.5V) Serial EEPROM
Microchip offers a wide variety of lead-free package options. Contact your local sales office for availabil-
ity or refer to the list on Microchip’s web site.
Part Number Suffix Designations
EE
L
OQ
OR
®, RFID, rfHCS and Memory Products
S
SB
SL
SM
SN
SO
SP
SS
ST
ST14
TO-92
TS
TT
VS
W
WB
WF
WFB
WM
Crystal Frequency Designator for PICmicro® MCUs
LP
RC
XT
HS
02
04
04
08
10
16
20
25
30
33
40
LCE
LCR
LCS
LF
LV
24
25
93
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Die in Waffle Pack
Bumped Die in Waffle Pack
14-lead Small Outline (150 mil)
8-lead Small Outline (207 mil)
8-lead Small Outline (150 mil)
Plastic Small Outline (SOIC) (300 mil)
Plastic Skinny DIP
Plastic Shrink Small Outline (SSOP)
Thin Shrink Small Outline (TSSOP 4.4 mm)
14-lead Thin Shrink Small Outline (TSSOP-14)
Transistor Outline
Thin Small Outline (8mm x 20mm)
SOT-23-3 Small Outline Transistor
Very Small Outline (8mm x 12mm)
Uncut Wafer
Bumped Wafer
Sawed Wafer on Frame
Bumped, Sawed Wafer on Frame
SOT385 Leadless Module
DC to 40 kHz, Low Power Crystal Oscillator
DC to 4 MHz, Resistor/Capacitor Oscillator
DC to 4 MHz, Standard Crystal Resonator Oscil-
lator
DC to 20 MHz, High Speed Crystal Oscillator
DC to 2 MHz, XT and RC Oscillator Support
DC to 4 MHz Internal, XT and RC Oscillator Sup-
port
DC to 200 kHz, LP Oscillator Support
DC to 8 MHz, HS Oscillator Support
DC to 10 MHz, HS Oscillator Support
DC to 16 MHz, XT Oscillator Support
DC to 20 MHz, HS Oscillator Support
DC to 25 MHz, XT Oscillator Support
DC to 30 MHz, HS Oscillator Support
DC to 33 MHz, XT Oscillator Support
DC to 40 MHz, HS Oscillator Support
Low Voltage CMOS EPROM/EEPROM MCU
Low Voltage CMOS ROM MCU
Low Voltage Security
Low Voltage FLASH MCU
Low Voltage
2-Wire (I
SPI
3-Wire (Microwire)
2
C)
PAGE 99