DM163025 Microchip Technology, DM163025 Datasheet - Page 101

PIC DEM FULL SPEED USB DEMO BRD

DM163025

Manufacturer Part Number
DM163025
Description
PIC DEM FULL SPEED USB DEMO BRD
Manufacturer
Microchip Technology
Datasheets

Specifications of DM163025

Main Purpose
Interface, USB 2.0 Host/Controller
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
PIC18F2455/2550/4455/4550
Primary Attributes
Full Speed (12Mbps)
Secondary Attributes
MPLAB ICE 2000/4000 Emulator Interface, Temp Sensor, Expansion and PICtail Headers
Processor To Be Evaluated
PIC18F4550
Interface Type
RS-232, USB
Silicon Manufacturer
Microchip
Core Architecture
PIC
Core Sub-architecture
PIC18
Silicon Core Number
PIC18F
Silicon Family Name
PIC18F4xxx
Kit Contents
Demo Board, Cables, CD & Documents
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
Q2086254

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DM163025
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
DM163025-1
Manufacturer:
MICROCHIP
Quantity:
12 000
Ordering Information for all Microchip PICmicro®, K
XXXXXXXXXX - XX X/XX XXX
QTP, SQTP or ROM Code; Special Requirements
Package:
1M
3M
7M
CB
CL
G
JW
L
LQ
MC
MF
ML
MM
MS
OT
P
PF
PQ
PT
Process Temperature:
Blank = 0°C to +70°C
I (Industrial) = -40°C to +85°C
E (Extended = -40°C to +125°C
Speed:
-90
-10
-12
-15
-17
-20
-25
-30
Option:
T = Tape and Reel Shipments
X = Rotated pinout
Device Type: (Up to 10 digits)
AA
C
C
CE
CR
F
FC
HC
HV
LC
LC
Note:
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1000pF COB Module
330pF COB Module
2x68pF COB Module (IOA2)
Chip on Board (COB)
Windowed CERQUAD
Lead Free
Windowed CERDIP
Plastic Leaded Chip Carrier (PLCC)
Plastic Low Quad Flatpack (LQFP)
Dual Flat-No Leads (DFN) 2x3
Dual Flat - No Leads (DFN)
Quad Flat - No Leads (QFN)
Quad Flat - No Leads (DFN)
Micro Small Outline (MSOP)
5-Lead or 6-Lead SOT-23
Plastic DIP
Plastic Thin Quad Flatpack
(TQFP 14x14)
Plastic Quad Flatpack (PQFP)
Plastic Thin Quad Flatpack (TQFP)
90 ns
100 ns
120 ns
150 ns
170 ns
200 ns or 20 MIPS
250 ns or 30 MIPS
300 ns
1.8V Serial EEPROM
CMOS EPROM/ROMless MCU
5V Serial EEPROM
CMOS EPROM/EEPROM MCU
CMOS ROM MCU
Flash MCU
High Speed serial EEPROM
High Speed
High Voltage
Low Voltage CMOS EPROM MCU
Low Voltage (2.5V) Serial EEPROM
Microchip offers a wide variety of lead-free package options. Contact your local sales office for availabil-
ity or refer to the list on Microchip’s web site.
Part Number Suffix Designations
EE
L
OQ
OR
®, RFID, rfHCS and Memory Products
S
SB
SL
SM
SN
SO
SP
SS
ST
ST14
TO-92
TS
TT
VS
W
WB
WF
WFB
WM
Crystal Frequency Designator for PICmicro® MCUs
LP
RC
XT
HS
02
04
04
08
10
16
20
25
30
33
40
LCE
LCR
LCS
LF
LV
24
25
93
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Die in Waffle Pack
Bumped Die in Waffle Pack
14-lead Small Outline (150 mil)
8-lead Small Outline (207 mil)
8-lead Small Outline (150 mil)
Plastic Small Outline (SOIC) (300 mil)
Plastic Skinny DIP
Plastic Shrink Small Outline (SSOP)
Thin Shrink Small Outline (TSSOP 4.4 mm)
14-lead Thin Shrink Small Outline (TSSOP-14)
Transistor Outline
Thin Small Outline (8mm x 20mm)
SOT-23-3 Small Outline Transistor
Very Small Outline (8mm x 12mm)
Uncut Wafer
Bumped Wafer
Sawed Wafer on Frame
Bumped, Sawed Wafer on Frame
SOT385 Leadless Module
DC to 40 kHz, Low Power Crystal Oscillator
DC to 4 MHz, Resistor/Capacitor Oscillator
DC to 4 MHz, Standard Crystal Resonator Oscil-
lator
DC to 20 MHz, High Speed Crystal Oscillator
DC to 2 MHz, XT and RC Oscillator Support
DC to 4 MHz Internal, XT and RC Oscillator Sup-
port
DC to 200 kHz, LP Oscillator Support
DC to 8 MHz, HS Oscillator Support
DC to 10 MHz, HS Oscillator Support
DC to 16 MHz, XT Oscillator Support
DC to 20 MHz, HS Oscillator Support
DC to 25 MHz, XT Oscillator Support
DC to 30 MHz, HS Oscillator Support
DC to 33 MHz, XT Oscillator Support
DC to 40 MHz, HS Oscillator Support
Low Voltage CMOS EPROM/EEPROM MCU
Low Voltage CMOS ROM MCU
Low Voltage Security
Low Voltage FLASH MCU
Low Voltage
2-Wire (I
SPI
3-Wire (Microwire)
2
C)
PAGE 99

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