PCA4981A Renesas Electronics America, PCA4981A Datasheet - Page 132

• Manufacturer Part Number: PCA4981A
• Description: DEV 80P6-B TO 40-PIN DIL STD PIT
• Manufacturer: Renesas Electronics America

Specifications of PCA4981A

• Module/board Type: Converter Board
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With/related Products: PC4701
• Lead Free Status / RoHS Status: Not Compliant, Contains lead / RoHS non-compliant

Appendix I
LCC
Leadless Chip Carrier (QFN: Quad Flat Non-leaded Package)
LCCSocket
IC socket used to connect an LCC package MCU to a QFP
package foot target.
LQFP
Low profile Quad Flat Package
MCP
Multi Chip Package
Mold CSP
Mold Chip Size/Scale Package
NQPACK (made by Tokyo Eletech Co., Ltd.)
Board that is mounted on the target system's foot pattern and used
to connect to the emulator via the NQSOCKET (male side).
NQSOCKET (made by Tokyo Eletech Co., Ltd.)
Socket used to connect NQPACK and board (female side).
Overmold BGA
Overmold Ball Grid Array
*All brand names and product names are trademarks or registered trademarks of their respective companies.
PC4701
The PC4701 is a generic name representing the PC4701U,
PC4701M, PC4701HS, PC4701L, PC4700H, and PC4700L.
Production of the PC4701M, PC4701HS, PC4701L, PC4700H
and PC4700L has been discontinued.
PC4816
The PC4816 is a generic name representing the PC4816B,
PC4816A and PC4816. Production of thePC4816B, PC4816A
and PC4816 has been discontinued.
QFP
Quad Flat Package
RFS
QFP/LCC package emulator MCU
RSS
DIP package emulator MCU
SDIP
Shrink Dual Inline Package
Smart BGA
Smart Ball Grid Array
SMCP
Stacked Multi Chip Package
Rev.1.00 2004.06 Page 132 of 135