XLT18SO-1 Microchip Technology, XLT18SO-1 Datasheet - Page 4

• Manufacturer Part Number: XLT18SO-1
• Description: SOCKET TRANSITION 18SOIC 300MIL
• Manufacturer: Microchip Technology

Specifications of XLT18SO-1

• Module/board Type: *
• Svhc: No SVHC (15-Dec-2010)
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: MPLAB™ICE
• For Use With: AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14DVA1006 - DEVICE ADAPTER ICE2000 18DIPDVA1001 - ADAPTER FOR PIC16F716 18DIPDAF18-4 - DEVICE ADAPTER FOR ICE4000DAF30-4 - DEVICE ATP FOR ICE4000AC162054 - HEADER INTERFACE ICD2 16F716DVA18XP180 - DEVICE ADAPTER 18F1320 PDIP 18LDAC162053 - HEADER INTERFACE ICD,ICD2 18DIPDVA16XP185 - ADAPTER DEVICE ICE 18DIP/SOICDVA16XP183 - ADAPTER ICE 18DIP/SOIC/SSOPDVA16XP182 - ADAPTR 712,716 DIP,SOIC,SSOPDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

Transition Socket Specification
TRANSITION SOCKET
APPLICATIONS – COMMENTS
AND SUGGESTIONS
Attention to component placement should be consid-
ered in mating the adapter sockets to the SOIC/SSOP
headers. If visual alignment is difficult in your applica-
tion, C-shaped end brackets have been included to aid
in header-to-adapter socket alignment. Clip the
brackets onto the SOIC/SSOP header.
The placement of vias around the Surface Mount
Technology (SMT) layout area should be examined.
Vias immediately adjacent to the end of a SMT pad
may inadvertently come into contact with the header
leads. Vias should be placed along the center line of
the SMT pad to lessen the chance of pin-to-pin shorts
while soldering.
The SOIC header is designed for SOIC body width of
0.300-inch, the adapter leads should be cut to fit the
0.150-inch and 0.208-inch SOIC body widths.
For information on packaging dimensions, please refer
to the “Packaging Specification” (DS00049).
© 2006 Microchip Technology Inc.
DS51194P-page 2