CY3280-BBM Cypress Semiconductor Corp, CY3280-BBM Datasheet - Page 5

• Manufacturer Part Number: CY3280-BBM
• Description: MODULE BREADBOARD CAPSENSE
• Manufacturer: Cypress Semiconductor Corp
• Series: CapSense™r

Specifications of CY3280-BBM

• Mfg Application Notes: Capacitance Sensing - AppNote CapSense Best Practices - AppNote
• Design Resources: CY3280-BBM Schematic
• Accessory Type: Prototyping Board
• Interface Type: Serial
• Operating Voltage: 5 V
• Silicon Manufacturer: Cypress
• Silicon Core Number: CAP1073264
• Kit Application Type: Sensing - Touch / Proximity
• Application Sub Type: Capacitive Touch
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: CY3280 Module Board
• For Use With: 428-2987 - CAPSENSE CONTROLLER DEV KIT
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 428-2992

GND spacing is
generalized for
noise immunity
and sensitivity.
Connection to
shield
electrode is
through a
jumper.
ESD protection
circuitry is not
included.
User Module
Parameters set
to supplied
overlay
thicknesses.
Unused pins
are not routed
directly to
GND.
0-Ω Resistors
populated
throughout.
Feature
Design
Universality of kit
required middle-ground
on many parameters.
Flexibility of module
boards for both CSD and
CSA control boards.
Development/evaluation
platform without
consistent overlay is
inherently vulnerable to
ESD events.
Projects optimized for
supplied hardware.
Pins brought out to
connector for
subsequent modules or
custom designs.
Universality of the board
enabled by population/
depopulation of 0-Ω
resistors.
Reason
Design is not optimized
for high-noise or very
thick overlays.
Higher resistance paths
can impair performance
of shield electrode in
CSD projects.
Direct or air-separated
ESD testing may impair
operation or damage
circuitry. +/-2kV limit on
PSoC pins (see
datasheet).
Sensitivity may not be
high enough for very
thick overlays.
Possible noise path.
Solder pads of 0-Ω
resistors increase
parasitic capacitance.
Impact
Increase spacing for
thicker overlays and
better sensitivity.
Decrease spacing for
greater noise immunity.
Dedicated trace for
shield electrode.
Remove jumpers
wherever possible.
Include an overlay and
ESD protection circuitry.
Thicker overlays may
require verification of
parameters to ensure
proper operation.
Tie unused sensing
traces directly to
ground.
Route traces directly to
sensing elements. Use
as few 0-Ω resistors as
possible.
Recommended
Change
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