LTM4614EV#PBF Linear Technology, LTM4614EV#PBF Datasheet - Page 15

• Manufacturer Part Number: LTM4614EV#PBF
• Description: IC UMODULE DC/DC DUAL 4A 144LGA
• Manufacturer: Linear Technology
• Series: µModuler
• Type: Point of Load (POL) Non-Isolatedr

Specifications of LTM4614EV#PBF

• Design Resources: LTM4614 Spice Model
• Output: 0.8 ~ 5 V
• Number Of Outputs: 2
• Power (watts): 12W
• Mounting Type: Surface Mount
• Voltage - Input: 2.38 ~ 5.5 V
• Package / Case: 144-LGA
• 1st Output: 0.8 ~ 5 VDC @ 4A
• 2nd Output: 0.8 ~ 5 VDC @ 4A
• Size / Dimension: 0.59" L x 0.59" W x 0.11" H (15mm x 15mm x 2.8mm)
• Power (watts) - Rated: 12W
• Operating Temperature: -40°C ~ 125°C
• Efficiency: 95%
• Dc To Dc Converter Type: Step Down
• Pin Count: 144
• Input Voltage: 5.5V
• Output Voltage: 1.49V
• Switching Freq: 1250KHz
• Output Current: 4A
• Package Type: LGA
• Output Type: Fixed
• Switching Regulator: Yes
• Load Regulation: 1.5%
• Line Regulation: 0.3%
• Mounting: Surface Mount
• Input Voltage (min): 2.375V
• Operating Temperature Classification: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• Lead Free Status / Rohs Status: Compliant

APPLICATIONS INFORMATION
Safety Considerations
The LTM4614 modules do not provide isolation from V
V
with a rating twice the maximum input current needs to be
provided to protect each unit from catastrophic failure.
Layout Checklist/Example
The high integration of LTM4614 makes the PCB board
layout very simple and easy. However, to optimize its electri-
cal and thermal performance, some layout considerations
are still necessary.
• Use large PCB copper areas for high current path,
OUT
including V
PCB conduction loss and thermal stress.
. There is no internal fuse. If required, a slow blow fuse
IN
, GND and V
GND1
GND1
GND2
GND2
OUT
V
V
IN1
IN2
. It helps to minimize the
C
C
IN2
IN1
M
L
K
H
G
D
J
F
E
C
B
A
1
Figure 11. Recommended PCB Layout
2
3
GND1
GND2
4
5
IN
I/O PINS
I/O PINS
6
to
7
8
• Place high frequency ceramic input and output capaci-
• Place a dedicated power ground layer underneath the
• To minimize the via conduction loss and reduce module
• Do not put via directly on pads unless the via is
Figure 11 gives a good example of the recommended
layout.
tors next to the V
high frequency noise.
unit.
thermal stress, use multiple vias for interconnection
between the top layer and other power layers.
capped.
9
10 11 12
GND2
V
OUT1
C
C
OUT1
OUT3
C
C
OUT2
OUT4
IN
4614 F11
, GND and V
V
GND1
V
GND2
OUT1
OUT2
OUT
LTM4614
pins to minimize
15
4614fa