QHW050A1-Q Lineage Power, QHW050A1-Q Datasheet - Page 16
![no-image](/images/manufacturer_photos/0/3/387/lineage_power_sml.jpg)
QHW050A1-Q
Manufacturer Part Number
QHW050A1-Q
Description
CONVERTER DC/DC 5V 50W OUT
Manufacturer
Lineage Power
Series
QHWr
Type
Isolated with Remote On/Offr
Datasheet
1.QHW050A1-Q.pdf
(22 pages)
Specifications of QHW050A1-Q
Output
5V
Number Of Outputs
1
Power (watts)
50W
Mounting Type
Through Hole
Voltage - Input
36 ~ 75V
Package / Case
8-DIP Module
1st Output
5 VDC @ 10A
Size / Dimension
2.28" L x 1.45" W x 0.50" H (57.9mm x 36.8mm x 12.7mm)
Power (watts) - Rated
50W
Operating Temperature
-40°C ~ 100°C
Efficiency
87.5%
Approvals
CE, CSA, UL, VDE
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
3rd Output
-
2nd Output
-
4th Output
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
QHW050A1-Q
Manufacturer:
TYCO
Quantity:
228
QHW050A1-Q, QHW075A1-Q, and QHW100A1-Q Power Modules;
dc-dc Converters: 36 to 75 Vdc Input, 5 Vdc Output; 50 W to 100 W
Thermal Considerations
Heat Transfer with Heat Sinks
Figure 32. Heat Sink Power Derating Curves;
Figure 33. Heat Sink Power Derating Curves;
16
16
20
15
10
20
15
10
5
0
5
0
0
0
10
10
Natural Convection; Transverse
Orientation
Natural Convection; Longitudinal
Orientation
LOCAL AMBIENT TEMPERATURE, T
LOCAL AMBIENT TEMPERATURE, T
20
20
30
30
40
40
50
50
60
60
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
(continued)
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
70
70
(continued)
80
80
A
A
(°C)
(°C)
90 100
90 100
8-2317 (F).a
8-2316 (F).a
Figure 34. Heat Sink Power Derating Curves;
Figure 35. Heat Sink Power Derating Curves;
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures 30 and
31 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance. The
use of Figure 30 is shown in the following example.
20
15
10
20
15
10
5
0
5
0
0
0
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
10
10
1 IN. HEAT SINK
1.0 m/s (200 lfm); Transverse
Orientation
1.0 m/s (200 lfm); Longitudinal
Orientation
LOCAL AMBIENT TEMPERATURE, T
LOCAL AMBIENT TEMPERATURE, T
1 IN. HEAT SINK
NO HEAT SINK
NO HEAT SINK
20
20
30
30
40
40
50
50
Tyco Electronics Corp.
60
60
70
70
August 2006
Data Sheet
80
80
A
A
(°C)
(°C)
90 100
90 100
8-2315 (F)
8-2314 (F)