JAHW075F1 Lineage Power, JAHW075F1 Datasheet - Page 16
JAHW075F1
Manufacturer Part Number
JAHW075F1
Description
CONVERTER DC/DC 3.3V 50W OUT
Manufacturer
Lineage Power
Series
JAHWr
Type
Isolated with Remote On/Offr
Datasheet
1.JAHW050F.pdf
(19 pages)
Specifications of JAHW075F1
Output
3.3V
Number Of Outputs
1
Power (watts)
50W
Mounting Type
Through Hole
Voltage - Input
36 ~ 75V
Package / Case
9-DIP Module
1st Output
3.3 VDC @ 15A
Size / Dimension
2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
Power (watts) - Rated
50W
Operating Temperature
-40°C ~ 100°C
Efficiency
88.6%
Approvals
CE, CSA, UL, VDE
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
3rd Output
-
2nd Output
-
4th Output
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
JAHW075F1
Manufacturer:
LUCENT
Quantity:
339
Company:
Part Number:
JAHW075F1-13
Manufacturer:
COPAL
Quantity:
1 152
Company:
Part Number:
JAHW075F1Z
Manufacturer:
VICOR
Quantity:
452
Part Number:
JAHW075F1Z 50W
Manufacturer:
GE
Quantity:
20 000
JAHW050F, JAHW075F, and JAHW100F Power Modules:
Data Sheet
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Output; 33 W to 66 W
April 2008
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compli-
ant finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3°C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot temperature is
260°C, while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process. If addi-
tional information is needed, please consult with your Lineage
Electronics Power System representative for more details.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Lineage
Power Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
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Lineage Power