FC250A1 Lineage Power, FC250A1 Datasheet - Page 12

• Manufacturer Part Number: FC250A1
• Description: CONVERTER DC/DC 2.5V 100W OUT
• Manufacturer: Lineage Power
• Series: FC250r
• Type: Isolated with Remote On/Offr

Specifications of FC250A1

• Output: 2.5V
• Number Of Outputs: 1
• Power (watts): 50W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: Module
• 1st Output: 2.5 VDC @ 40A
• Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
• Power (watts) - Rated: 100W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 85%
• Approvals: CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -

18 Vdc to 36 Vdc Input, 5 Vdc Output; 50 W
Thermal Considerations
Heat Transfer with Heat Sinks
Then solve the following equation:
Use Figure 17 to determine air velocity for the 1/4 inch
heat sink.
The minimum airflow necessary for the FC250A1 mod-
ule is 1.5 m/s (300 ft./min.).
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink ( cs) and
sink-to-ambient ( sa) as shown in Figure 18.
Figure 18. Resistance from Case-to-Sink and
12
12
ca
ca
ca
P
=
=
=
D
Sink-to-Ambient
3 °C/W
----------------------- -
----------------------
T
85
T
C
10
P
C
–
–
D
55
T
A
cs
T
S
(continued)
sa
(continued)
T
A
8-1304 (F).e
For a managed interface using thermal grease or foils,
a value of cs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
EMC Considerations
For assistance with designing for EMC compliance,
refer to the FLTR100V10 Filter Module Data Sheet
(DS99-294EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. This module is designed for
solder interconnection between its terminal pins and
the customer’s board. For additional layout guidelines,
refer to the FLTR100V10 Filter Module Data Sheet
(DS99-294EPS).
sa
=
------------------------ -
T
C
P
–
D
T
A
–
cs
Tyco Electronics Corp.
July 1998