HW005A0F-S Lineage Power, HW005A0F-S Datasheet - Page 26

• Manufacturer Part Number: HW005A0F-S
• Description: CONVERTER DC/DC 3.3V 17W OUT SMD
• Manufacturer: Lineage Power
• Series: HWr
• Type: Isolated with Remote On/Offr

Specifications of HW005A0F-S

• Output: 3.3V
• Number Of Outputs: 1
• Power (watts): 17W
• Mounting Type: Surface Mount
• Voltage - Input: 36 ~ 75V
• Package / Case: 18-DIP SMD Module (6 Leads)
• 1st Output: 3.3 VDC @ 5A
• Size / Dimension: 1.86" L x 1.16" W x 0.34" H (47.2mm x 29.5mm x 8.6mm)
• Power (watts) - Rated: 17W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 87%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: No

Data Sheet
October 5, 2009
Surface Mount Information
Figure 73. Time Limit Curve Above 205
Lead Free Soldering
The –Z version SMT modules of the HW/HC series
are lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 74.
MSL Rating
The HW/HC series SMT modules have a MSL rating
of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
LINEAGE
240
235
230
225
220
205
200
215
210
0
POWER
10
20
TIME LIMIT (S)
18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
30
40
(continued)
o
C Reflow .
50
60
HW/HC004/005/006 Series DC-DC Power Module:
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
Figure 74. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module
will meet the solder ball requirements per
J-STD-001B. These requirements state that solder
balls must neither be loose nor violate the power
module minimum electrical spacing.
The cleanliness designator of the open frame power
module is C00 (per J specification).
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
26