CC30-4815SRP-E TDK Corporation, CC30-4815SRP-E Datasheet - Page 10
![CONV DC/DC 48V 15V 2A 30W SMD](/photos/21/59/215965/4648488_sml.jpg)
CC30-4815SRP-E
Manufacturer Part Number
CC30-4815SRP-E
Description
CONV DC/DC 48V 15V 2A 30W SMD
Manufacturer
TDK Corporation
Series
CC-P-Er
Type
Isolatedr
Datasheets
1.CC15-4803SFP-E.pdf
(2 pages)
2.CC15-4803SFP-E.pdf
(16 pages)
3.CC15-4803SFP-E.pdf
(11 pages)
Specifications of CC30-4815SRP-E
Output
15V
Number Of Outputs
1
Power (watts)
30W
Mounting Type
Surface Mount
Voltage - Input
48V
Package / Case
20-DIP SMD Module (17 Leads)
1st Output
15 VDC @ 2A
Size / Dimension
1.51" L x 1.32" W x 0.33" H (38.4mm x 33.5mm x 8.3mm)
Power (watts) - Rated
30W
Operating Temperature
-40°C ~ 85°C
Efficiency
89%
Approvals
CSA, cUL, EN, UL
Dc / Dc Converter O/p Type
Fixed
No. Of Outputs
1
Input Voltage
36V To 76V
Power Rating
30W
Output Voltage
15V
Output Current
2A
Approval Bodies
CULus, CSA
Supply Voltage
48V
Dc/dc Converter Mounting
SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-
4th Output
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
5. Soldering Conditions / Cleaning Condi
5. Soldering Conditions / Cleaning Conditions / Installation Method
5-1 Soldering Conditions
【DIP Model】
Perform soldering of the converter to the board according to the conditions shown in Table 5-1.
【SMD Model】
Lead free solder / high temperature reflow process conditions are shown in Figure 5-1.
5-2 Washing Conditions
We do not recommend board cleaning after soldering, we recommend not performing cleaning, but when cleaning becomes
necessary, perform it according to the conditions shown in Table 5-2
※Contact TDK-Lambda concerning items not mentioned or items which are not clear.
5. Soldering Conditions / Cleaning Condi
5. Soldering Conditions / Cleaning Condi
Soldering is to be performed only one time per pin.
The number of times permitted for reflow is 1 time.
225
Ty2
Ty1
TP
Isopropyl Alcohol
Cleaning Fluid
A
Fig. 5-1 Reflow Process Conditions for SMD Models
Table 5-2 Cleaning Fluid and Test Conditions
Table 5-1 Solder Conditions for DIP Models
ハンダ付け時間(s)
A '
Solder Iron
Solder Dip
Method
Cold Bath Cleaning R.T
Ultrasonic Wave 60℃
Vapor Cleaning 83℃
tions / Installation Method
tions / Installation Method
tions / Installation Method
B
Cleaning Method
B '
260℃ 10 sec Max.
C
380℃ 3 sec Max.
Condition
A '
B '
A
B
C
60 sec.
60 sec.
60 sec.
Time
Ty1~Ty2:20~100sec
225℃以上:20~40sec
-1.0~-5.0℃/sec
TP:MAX 245℃
Ty1:150±10℃
Ty2:170±10℃
1.0~3.0℃/sec
1.0~4.0℃/sec