B32926C3106M EPCOS Inc, B32926C3106M Datasheet - Page 10

• Manufacturer Part Number: B32926C3106M
• Description: CAP 10UF 305VAC EMI SUPPRESSION
• Manufacturer: EPCOS Inc
• Series: MKP B32926r

Specifications of B32926C3106M

• Capacitance: 10µF
• Voltage - Ac: 305V
• Voltage - Dc: 630V
• Dielectric Material: Polypropylene, Metallized
• Tolerance: ±20%
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Through Hole
• Package / Case: Radial
• Size / Dimension: 1.634" L x 1.102" W (41.50mm x 28.00mm)
• Height: 1.673" (42.50mm)
• Termination: PC Pins
• Lead Spacing: 1.476" (37.50mm)
• Features: EMI Suppression
• Capacitor Application: Safety / Suppression
• Capacitor Dielectric Type: Polypropylene
• Capacitance Tolerance: ± 20%
• Voltage Rating: 305VDC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Esr (equivalent Series Resistance): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 495-1891; B32926C3106M000

1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32921C/D ... B32926C/D
X2 / 305 V AC
max
. Long exposure to temperatures above this type-related temperature limit
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