B32674D6225K EPCOS Inc, B32674D6225K Datasheet - Page 26

• Manufacturer Part Number: B32674D6225K
• Description: CAP 2.2UF 10% 630V METAL POLYPRO
• Manufacturer: EPCOS Inc
• Series: MKP B32674r

Specifications of B32674D6225K

• Capacitance: 2.2µF
• Tolerance: ±10%
• Lead Spacing: 1.083" (27.50mm)
• Voltage - Ac: 350V
• Voltage - Dc: 630V
• Dielectric Material: Polypropylene, Metallized
• Esr (equivalent Series Resistance): 8.0 mOhm
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Through Hole
• Package / Case: Radial
• Size / Dimension: 1.240" L x 0.591" W (31.50mm x 15.00mm)
• Height: 0.965" (24.50mm)
• Termination: PC Pins
• Features: AC and Pulse
• Voltage Rating: 630 Volts
• Esr: 6 mOhms
• Termination Style: Radial
• Dimensions: 15 mm W x 31.5 mm L x 24.5 mm H
• Operating Temperature Range: - 55 C to + 85 C
• Product: Metallized Polypropylene Capacitors
• Tolerance (+ Or -): 10%
• Voltage: 630VDC/350VAC
• Temp Coeff (dielectric): PLYP
• Mounting Style: Through Hole
• Construction: Radial
• Failure Rate: Not Required
• Seated Plane Height: 24.5mm
• Product Diameter (mm): Not Requiredmm
• Product Height (mm): 24.5mm
• Product Depth (mm): 15mm
• Product Length (mm): 31.5mm
• Lead Spacing (nom): 27.5mm
• Lead Diameter (nom): 0.8mm
• Operating Temp Range: -40C to 100C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 495-2928; B32674D6225K000

3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32674 ... B32678
MKP DC link
high power series
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