HLMP-FW66-NP0DD Avago Technologies US Inc., HLMP-FW66-NP0DD Datasheet - Page 6

• Manufacturer Part Number: HLMP-FW66-NP0DD
• Description: LED 5MM FLAT TOP INGAN WHITE
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-FW66-NP0DD

• Viewing Angle: 85°
• Package / Case: Radial - 2 Lead
• Color: White
• Millicandela Rating: 915mcd
• Current - Test: 20mA
• Wavelength - Dominant: 6800K
• Voltage - Forward (vf) Typ: 3.2V
• Lens Type: Clear
• Lens Style/size: Round, 5mm, T-1 3/4
• Height: 7.00mm
• Mounting Type: Through Hole
• Resistance Tolerance: 6800K
• Led Size: T-1 3/4
• Illumination Color: White
• Lens Color/style: Clear
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Wavelength - Peak: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: HLMP-FW66-NPODD

Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must
• It is recommended that tooling made to precisely form
Soldering Condition:
• Care must be taken during PCB assembly and
• The closest LED is allowed to solder on board is
• Recommended soldering condition:
Recommended Wave Soldering Profile
250
200
150
100
length prior to insertion and soldering into PC board.
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
and cut the leads to length rather than rely upon hand
operation.
soldering process to prevent damage to LED
component.
1.59mm below the body (encapsulant epoxy) for those
parts without standoff.
Pre-heat temperature 105 °C Max.
Preheat time
Peak temperature
Dwell time
50
30
0
10
FLUXING
20
PREHEAT
30 sec Max
250 °C Max.
Wave Soldering
3 sec Max.
TURBULENT WAVE
30
40
TIME - SECONDS
Manual Solder
Dipping
−
−
260 °C Max.
5 sec Max
50
60
70
• Wave soldering parameter must be set and
• If necessary, use fixture to hold the LED
• Proper handling is imperative to avoid excessive
• Special attention must be given to board
• Recommended PC board plated through holes size
Note: Refer to application note AN1027 for more information on
soldering LED components.
maintain according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering
profile to ensure the soldering profile used is
always conforming to recommended soldering
condition.
component in proper orientation with respect to
the PCB during soldering process.
thermal stresses to LED components when
heated. Therefore, the soldered PCB must be
allowed to cool to room temperature, 25°C before
handling.
fabrication, solder masking, surface plating and
lead holes size and component orientation to
assure solderability.
for LED component leads.
LED component
ead size
0.457 x 0.457mm
(0.018 x 0.018inch)
0.508 x 0.508mm
(0.020 x 0.020inch)
LAMINAR WAVE
80
HOT AIR KNIFE
90
100
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
1.049 to 1.150mm
Plated through
hole diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
(0.041 to 0.045 inch)
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD