B32923C3474M EPCOS Inc, B32923C3474M Datasheet - Page 10

CAP .47UF 305VAC EMI SUPPRESSN

B32923C3474M

Manufacturer Part Number
B32923C3474M
Description
CAP .47UF 305VAC EMI SUPPRESSN
Manufacturer
EPCOS Inc
Series
MKP B32923r
Datasheets

Specifications of B32923C3474M

Capacitance
0.47µF
Tolerance
±20%
Voltage - Ac
305V
Voltage - Dc
630V
Dielectric Material
Polypropylene, Metallized
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Package / Case
Radial
Size / Dimension
1.043" L x 0.335" W (26.50mm x 8.50mm)
Height
0.650" (16.50mm)
Termination
PC Pins
Lead Spacing
0.886" (22.50mm)
Features
EMI Suppression
Voltage Rating
305 VoltsAC
Termination Style
Radial
Product
Metallized Polypropylene Suppression Capacitors
Brand/series
B32923 Series
Diameter, Lead Wire
0.8 mm
Dissipation Factor
1 %
Dissipation Factor, Test Condition
@ 1 kHz
Insulation Resistance
100000 Megohms
Lead Pitch
22.5 mm
Length
26.5 mm
Length, Lead
6 mm
Material, Element
Polypropylene Film
Temperature, Operating, Maximum
+125 °C
Temperature, Operating, Minimum
-55 °C
Voltage, Rating
305 VAC
Max. Operating Temperature
125°C
Approvals
UL, cUL, ENEC, CQC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Esr (equivalent Series Resistance)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
495-4207

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1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32921C/D ... B32926C/D
X2 / 305 V AC
max
. Long exposure to temperatures above this type-related temperature limit
Page 10 of 18

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