HLMP-EL08-X1000 Avago Technologies US Inc., HLMP-EL08-X1000 Datasheet - Page 13
![LED AMBER 590NM](/photos/15/75/157552/hlmp-exxx_wht_sml.jpg)
HLMP-EL08-X1000
Manufacturer Part Number
HLMP-EL08-X1000
Description
LED AMBER 590NM
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HLMP-EL15-VY0DD.pdf
(15 pages)
Specifications of HLMP-EL08-X1000
Viewing Angle
8°
Package / Case
Radial - 2 Lead
Color
Amber
Luminous Flux @ Current - Test
500 mlm
Millicandela Rating
14100mcd
Current - Test
20mA
Wavelength - Dominant
590nm
Wavelength - Peak
592nm
Voltage - Forward (vf) Typ
2.02V
Lens Type
Clear
Lens Style/size
Round, 5mm, T-1 3/4
Height
8.71mm
Mounting Type
Through Hole
Resistance Tolerance
590nm
Led Size
T-1 3/4
Illumination Color
Amber
Lens Color/style
Water Clear
Wavelength
590 nm
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
Q2297271A
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HLMP-EL08-X1000
Manufacturer:
AVAGO
Quantity:
40 000
Company:
Part Number:
HLMP-EL08-X1000
Manufacturer:
AVAGO
Quantity:
50 000
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Figure 10. Recommended wave soldering profile
Ammo Pack Drawing
13
(0.7087 ± 0.0197)
18.00 ± 0.50
250
200
150
100
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
50
0
(0.3593 ± 0.0246)
9.125 ± 0.625
10
(0.25 ± 0.0512)
6.35 ± 1.30
20
30
PREHEAT
TURBULENT WAVE
(0.50 ± 0.0118)
12.70 ± 0.30
40
TIME (MINUTES)
(0.50 ± 0.0394)
12.70 ± 1.00
CATHODE
50
(0.0276 ± 0.0079)
0.70 ± 0.20
60
70
A
VIEW A–A
LAMINAR WAVE
80
HOT AIR KNIFE
A
90
100
∅
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
(0.1575 ± 0.008)
4.00 ± 0.20
TYP.
(0.807 ± 0.039)
20.50 ± 1.00