HLMP-EG08-WZ000 Avago Technologies US Inc., HLMP-EG08-WZ000 Datasheet - Page 13
HLMP-EG08-WZ000
Manufacturer Part Number
HLMP-EG08-WZ000
Description
LED 5MM 635NM RED WATER CLEAR
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HLMP-EL15-VY0DD.pdf
(15 pages)
Specifications of HLMP-EG08-WZ000
Viewing Angle
8°
Package / Case
Radial - 2 Lead
Color
Red
Luminous Flux @ Current - Test
500 mlm
Millicandela Rating
10750mcd
Current - Test
20mA
Wavelength - Dominant
626nm
Wavelength - Peak
635nm
Voltage - Forward (vf) Typ
1.9V
Lens Type
Clear
Lens Style/size
Round, 5mm, T-1 3/4
Height
8.71mm
Mounting Type
Through Hole
Resistance Tolerance
626nm
Led Size
T-1 3/4
Illumination Color
Red
Lens Color/style
Untinted Non-Diffused
Operating Voltage
1.9 V
Wavelength
626 nm
Luminous Intensity
5500 mcd to 16000 mcd
Operating Current
20 mA
Lens Dimensions
5 mm
Lens Shape
Dome
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Other names
516-1375
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HLMP-EG08-WZ000
Manufacturer:
AVAGO
Quantity:
50 000
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Figure 10. Recommended wave soldering profile
Ammo Pack Drawing
13
(0.7087 ± 0.0197)
18.00 ± 0.50
250
200
150
100
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
50
0
(0.3593 ± 0.0246)
9.125 ± 0.625
10
(0.25 ± 0.0512)
6.35 ± 1.30
20
30
PREHEAT
TURBULENT WAVE
(0.50 ± 0.0118)
12.70 ± 0.30
40
TIME (MINUTES)
(0.50 ± 0.0394)
12.70 ± 1.00
CATHODE
50
(0.0276 ± 0.0079)
0.70 ± 0.20
60
70
A
VIEW A–A
LAMINAR WAVE
80
HOT AIR KNIFE
A
90
100
∅
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
(0.1575 ± 0.008)
4.00 ± 0.20
TYP.
(0.807 ± 0.039)
20.50 ± 1.00