HLMP-EL08-Z3K00 Avago Technologies US Inc., HLMP-EL08-Z3K00 Datasheet - Page 13
HLMP-EL08-Z3K00
Manufacturer Part Number
HLMP-EL08-Z3K00
Description
LED ROUND 5MM 590NM AMBER 8DEG
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HLMP-EL15-VY0DD.pdf
(15 pages)
Specifications of HLMP-EL08-Z3K00
Viewing Angle
8°
Package / Case
Radial - 2 Lead
Color
Amber
Luminous Flux @ Current - Test
500 mlm
Current - Test
20mA
Wavelength - Dominant
590nm
Wavelength - Peak
592nm
Voltage - Forward (vf) Typ
2.02V
Lens Type
Clear
Lens Style/size
Round, 5mm, T-1 3/4
Height
8.71mm
Mounting Type
Through Hole
Resistance Tolerance
590nm
Led Size
T-1 3/4
Illumination Color
Amber
Lens Color/style
Amber Translucent
Wavelength
590 nm
Mounting Style
Through Hole
Led Color
Amber
Luminous Intensity @ Test
35cd
Wavelength Typ
590nm
Forward Current @ Test
20mA
Forward Current If Max
50mA
Led Mounting
Through Hole
Rohs Compliant
Yes
Forward Voltage @ Test
2.02V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Millicandela Rating
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HLMP-EL08-Z3K00
Manufacturer:
AVAGO
Quantity:
40 000
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Figure 10. Recommended wave soldering profile
Ammo Pack Drawing
13
(0.7087 ± 0.0197)
18.00 ± 0.50
250
200
150
100
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
50
0
(0.3593 ± 0.0246)
9.125 ± 0.625
10
(0.25 ± 0.0512)
6.35 ± 1.30
20
30
PREHEAT
TURBULENT WAVE
(0.50 ± 0.0118)
12.70 ± 0.30
40
TIME (MINUTES)
(0.50 ± 0.0394)
12.70 ± 1.00
CATHODE
50
(0.0276 ± 0.0079)
0.70 ± 0.20
60
70
A
VIEW A–A
LAMINAR WAVE
80
HOT AIR KNIFE
A
90
100
∅
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
(0.1575 ± 0.008)
4.00 ± 0.20
TYP.
(0.807 ± 0.039)
20.50 ± 1.00