HSMY-C280 Avago Technologies US Inc., HSMY-C280 Datasheet
![LED CHIP GAP YELLOW TOP MOUNT](/photos/15/72/157241/av02-0551en_sml.jpg)
HSMY-C280
Specifications of HSMY-C280
Available stocks
Related parts for HSMY-C280
HSMY-C280 Summary of contents
Page 1
... GaP Product Number Color HSMG-C280 Green HSMS-C280 HER HSMY-C280 Yellow CAUTION: HSMx-C280 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Features • Extremely small size (1.0 x 0.5 x 0.4 mm) • 0402 industry standard footprint • ...
Page 2
Package Dimensions LED DIE 1.0 (0.04) DIFFUSED EPOXY PC BOARD CATHODE LINE 0.30 (0.012) SOLDERING TERMINAL NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 CATHODE MARK 0.5 (0.02) ...
Page 3
... Optical Characteristics 25˚C A Part Number Color HSMA-C280 AS Amber HSMC-C280 AS Red HSML-C280 Orange HSMT-C280 AS Deep Red HSMG-C280 GaP Green HSMS-C280 HER HSMY-C280 GaP Yellow N otes: 1. The luminous intensity measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package The dominant wavelength, λ derived from the CIE Chromatically Diagram and represents the perceived color of the device θ is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 1/2 HSMA/C/L/T-C280 25 100 –0 to +85 – ...
Page 4
Color Bin Limits [1] Green Color Bins Dom. Wavelength (nm) Bin ID Min. A 561.5 B 564.5 C 567.5 D 570.5 E 57.5 T olerance: ± 1 nm. [1] Yellow/Amber Color Bins Dom. Wavelength (nm) Bin ID Min. A 582.0 B ...
Page 5
RED AMBER 80 AS DEEP 70 RED AS 60 ORANGE 500 550 600 650 700 WAVELENGTH - nm Figure 1a. Relative intensity vs. wavelength. 100 AS AlInGaP 10 HER LPE ...
Page 6
SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 4°C/SEC. MAX. OVER 2 MIN. TIME Figure 6. Recommended reflow soldering profile. HSMx-C280 fig 6 0.5 (0.02) 0.5 0.5 0.5 (0.02) (0.02) (0.02) Figure 8. Recommended soldering pattern for HSMx-C280. HSMx-C280 fig ...
Page 7
DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) Figure 11. Tape dimensions. END THERE SHALL BE A MOUNTED WITH MINIMUM OF 160 mm COMPONENTS (6.3 INCH) OF EMPTY COMPONENT PUNCHED ...
Page 8
Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-09EN AV02-0602EN - July 25, 2007 www.avagotech.com ...