B32922C3334M EPCOS Inc, B32922C3334M Datasheet - Page 12

• Manufacturer Part Number: B32922C3334M
• Description: CAP .33UF 305VAC EMI SUPPRESSION
• Manufacturer: EPCOS Inc
• Series: MKP B32922r

Specifications of B32922C3334M

• Capacitance: 0.33µF
• Tolerance: ±20%
• Lead Spacing: 0.591" (15.00mm)
• Voltage - Ac: 305V
• Voltage - Dc: 630V
• Dielectric Material: Polypropylene, Metallized
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Through Hole
• Package / Case: Radial
• Size / Dimension: 0.709" L x 0.315" W (18.00mm x 8.00mm)
• Height: 0.551" (14.00mm)
• Termination: PC Pins
• Features: EMI Suppression
• Voltage Rating: 305 Volts
• Termination Style: Radial
• Dimensions: 8 mm W x 18 mm L x 14 mm H
• Operating Temperature Range: 0 C to + 110 C
• Dissipation Factor Df: 1
• Product: Metallized Polypropylene Suppression Capacitors
• Brand/series: B32922 Series
• Diameter, Lead Wire: 0.8 mm
• Dissipation Factor: 1 %
• Dissipation Factor, Test Condition: @ 1 kHz
• Insulation Resistance: 100000 Megohms
• Lead Pitch: 15 mm
• Length: 18 mm
• Length, Lead: 6 mm
• Material, Element: Polypropylene Film
• Temperature, Operating, Maximum: +125 °C
• Temperature, Operating, Minimum: -55 °C
• Voltage, Rating: 305 VAC
• Max. Operating Temperature: 125°C
• Approvals: UL, cUL, ENEC, CQC
• Tolerance (+ Or -): 20%
• Voltage: 305VAC
• Temp Coeff (dielectric): PLYP
• Mounting Style: Through Hole
• Construction: Radial
• Failure Rate: Not Required
• Seated Plane Height: 14mm
• Product Diameter (mm): Not Requiredmm
• Product Height (mm): 14mm
• Product Depth (mm): 8mm
• Product Length (mm): 18mm
• Lead Spacing (nom): 15mm
• Lead Diameter (nom): 0.8mm
• Operating Temp Range: -40C to 105C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Esr (equivalent Series Resistance): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-2321; B32922C3334M000

3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32921C/D ... B32926C/D
X2 / 305 V AC
Page 12 of 18