HLMP-0401 Avago Technologies US Inc., HLMP-0401 Datasheet

LED 2.5X7.6MM 585NM YELLOW DIFF

HLMP-0401

Manufacturer Part Number
HLMP-0401
Description
LED 2.5X7.6MM 585NM YELLOW DIFF
Manufacturer
Avago Technologies US Inc.
Type
Uni-Colorr
Datasheet
1.HLMP-0504.pdf (8 pages)

Specifications of HLMP-0401

Viewing Angle
100°
Color
Yellow
Millicandela Rating
3.6mcd
Current - Test
20mA
Wavelength - Dominant
585nm
Wavelength - Peak
583nm
Voltage - Forward (vf) Typ
2.1V
Lens Type
Diffused, Yellow Tinted
Lens Style/size
Rectangle, 7.6mm x 2.5mm
Package / Case
Radial - 2 Lead
Height
7.69mm
Mounting Type
Through Hole
Resistance Tolerance
585nm
Led Size
2.5 mm x 7.6 mm
Illumination Color
Yellow
Lens Color/style
Tinted Diffused
Operating Voltage
2.1 V
Wavelength
585 nm
Luminous Intensity
3.6 mcd
Operating Current
20 mA
Lens Dimensions
2.5 mm x 7.6 mm
Lens Shape
Rectangular
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Emitting Color
Amber
Test Current (it)
20mA
Forward Current
20mA
Dominant Wave Length
585nm
Forward Voltage
2.6V
Product Length (mm)
7.62mm
Product Height (mm)
8mm
Product Depth (mm)
2.54mm
Mounting
Through Hole
Peak Wavelength
583nm
Shape Type
Rectangular
Chip Material
GaAsP
Main Category
Standard LED
Number Of Elements
1
Pin Count
2
Operating Temperature Classification
Industrial
Operating Temp Range
-40C to 100C
Reverse Voltage
5V
Power Dissipation
85mW
Bulb Size
2.5mm X 7.6mm
Led Color
Yellow
Forward Current If
20mA
Led Mounting
Through Hole
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
516-1278

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
HLMP-0401
Manufacturer:
HEWLETTP
Quantity:
1 600
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
HLMP-0401
Manufacturer:
AVAGO
Quantity:
40 000
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
HLMP-0401-B0000
Manufacturer:
AVAGO
Quantity:
50 000
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
HLMP-0401-D0002
Manufacturer:
AVAGO
Quantity:
50 000
HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504
2.5 mm x 7.6 mm Rectangular LED Lamps
Data Sheet
Description
The HLMP-R100, -0301, -0401,
lamps encapsulated in a radial lead rectangular epoxy
package. They utilize a tinted, diffused epoxy to
provide high on-off contrast and a flat high intensity
emitting surface. Borderless package design allows
creation of uninterrupted light emitting areas.
The HLMP-R100 uses a double heterojunction (DH)
absorbing substrate (AS) aluminum gallium arsenide
(AlGaAs) red LED chip in a light red epoxy package. This
combination produces outstanding light output over a
wide range of drive currents.
The HLMP-0301 has a high efficiency red GaAsP on
GaP LED chip in a light red epoxy package.
The HLMP-0401 provides a yellow GaAsP on GaP LED chip
in a yellow epoxy package.
The HLMP-0504 provides a green GaP LED chip in a green
epoxy package.
Package Dimensions
7.62 (0.300)
6.99 (0.275)
2.54 (0.100)
2.16 (0.085)
SIDE VIEW
8.00 (0.315)
7.37 (0.290)
7.62 (0.300)
7.11 (0.280)
2.54 (0.100)
2.29 (0.090)
29.21 (1.15) MIN.
CATHODE LEAD
1.27 (0.50)
NOMINAL
-0504 are solid state
SQ. NOMINAL
NOTES:
1. ALL DIMENSIONS ARE IN
2. AN EPOXY MENISCUS MAY EXTEND
3. THERE IS A MXIMUM 1° TAPER FROM
0.46 (0.018)
MILLIMETERS (INCHES).
ABOUT 1 mm (0.040") DOWN THE LEADS.
BASE TO THE TOP OF LAMP.
BOTTOM VIEW
Features
• Rectangular light emitting surface
• Flat high sterance emitting surface
• Stackable on 2.54 mm (0.100 inch) centers
• Ideal as flush mounted panel indicators
• Ideal for backlighting legends
• Long life: solid state reliability
• Choice of 4 bright colors
• IC compatible/low current requirements
– DH AS AlGaAs Red
– High Efficiency Red
– Yellow
– High Performance Green
2.54 (0.100)
NOMINAL

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HLMP-0401 Summary of contents

Page 1

... The HLMP-0301 has a high efficiency red GaAsP on GaP LED chip in a light red epoxy package. The HLMP-0401 provides a yellow GaAsP on GaP LED chip in a yellow epoxy package. The HLMP-0504 provides a green GaP LED chip in a green epoxy package. ...

Page 2

... DH AlGaAs Red HLMP-R100 HLMP-R100-FG0xx Red HLMP-0301 HLMP-0301-C00xx HLMP-0301-DECxx HLMP-0301-CD0xx Yellow HLMP-0401 HLMP-0401-B00xx HLMP-0401-D00xx HLMP-0401-CD0xx HLMP-0401-DEBxx Green HLMP-0504 HLMP-0504-B00xx HLMP-0504-DECxx HLMP-0504-CD0xx HLMP-0504-C00xx Part Numbering System HLMP - Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads DD: Ammo Pack, Straight Leads ...

Page 3

... The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond not recommended that the device be operated at peak current beyond the peak forward current listed in the Absolute Maximum Ratings. 3 HLMP-R100 HLMP-0301 HLMP-0401 300 ...

Page 4

... CIE chromaticity diagram and represents the single wavelength which defines the color of the d device. 3. Radiant intensity watts/steradian, may be found from the equation I e luminous efficacy in lumens/watt. 1.0 GREEN 0.5 YELLOW 0 500 550 Figure 1. Relative intensity vs. wavelength 25°C HLMP-0301 HLMP-0401 100 100 645 635 637 626 260 260 1.8 2.2 1.9 2 ...

Page 5

AlGaAs RED HER 50 YELLOW GREEN 10 0 1.0 2.0 3.0 4.0 5.0 V – FORWARD VOLTAGE – Figure 2. Forward current vs. forward voltage. V (300 mA) for AlGaAs Red ...

Page 6

Intensity Bin Limits Intensity Range (mcd) Color Bin Min. Red C 0.5 D 2.4 E 3.8 F 6.1 G 9.7 H 15.5 I 24.8 J 39.6 K 63.4 L 101.5 M 162.4 N 234.6 O 340.0 P 540.0 Q 850.0 ...

Page 7

Color Categories Lambda (nm) Color Category# Min. Green 6 561.5 5 564.5 4 567.5 3 570.5 2 573.5 Yellow 1 582.0 3 584.5 2 587.0 4 589.5 5 592.0 Tolerance for each bin limit is ±0.5 nm. Mechanical Option Matrix ...

Page 8

Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any ...

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