LTL-1CHEE Lite-On Electronics, LTL-1CHEE Datasheet - Page 5

LED 3MM HI-EFF RED TRANSPARENT

LTL-1CHEE

Manufacturer Part Number
LTL-1CHEE
Description
LED 3MM HI-EFF RED TRANSPARENT
Manufacturer
Lite-On Electronics
Type
Uni-Colorr
Datasheet

Specifications of LTL-1CHEE

Led Size
T-1
Illumination Color
Red
Lens Color/style
Transparent
Operating Voltage
2.6 V
Wavelength
635 nm
Operating Current
30 mA
Lens Shape
Dome
Mounting Style
Through Hole
Viewing Angle
45°
Package / Case
Radial - 2 Lead
Color
Red
Millicandela Rating
19mcd
Current - Test
10mA
Wavelength - Dominant
625nm
Wavelength - Peak
635nm
Voltage - Forward (vf) Typ
2V
Lens Type
Clear, Red Tinted
Lens Style/size
Round, 3.1mm
Height
5.20mm
Mounting Type
Through Hole
Resistance Tolerance
625nm
Package Type
T-1
Emitting Color
Red
Luminous Intensity
19mcd
Test Current (it)
10mA
Forward Current
30mA
Dominant Wave Length
625nm
Forward Voltage
2.6V
Product Length (mm)
3.8mm
Product Height (mm)
5.2mm
Product Depth (mm)
3.8mm
Mounting
Through Hole
Peak Wavelength
635nm
Shape Type
Circular
Chip Material
GaAsP
Main Category
Standard LED
Number Of Elements
1
Pin Count
2
Operating Temperature Classification
Industrial
Operating Temp Range
-55C to 100C
Reverse Voltage
5V
Power Dissipation
100mW
Lens Dimensions
3.1x3.1x4.1mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
160-1704
LTL-1CHEE
Q1566466

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LTL-1CHEE
Manufacturer:
LITEON
Quantity:
40 000
Part Number:
LTL-1CHEE-002
Manufacturer:
LITEON
Quantity:
40 000
Part Number:
LTL-1CHEE-002A
Manufacturer:
LITEON
Quantity:
40 000
Part Number:
LTL-1CHEE-011
Manufacturer:
LITEON
Quantity:
40 000
Part Number:
LTL-1CHEE-012A
Manufacturer:
LITEON
Quantity:
40 000
Part Number:
LTL-1CHEE-072A
Quantity:
3 000
1. Application
2. Storage
3. Cleaning
4. Lead Forming & Assembly
5. Soldering
Part No. : LTL-1CHEE
BNS-OD-C131/A4
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the leadframe as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or
Recommended soldering conditions :
Temperature
Soldering time
catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED lamp
product.
Soldering iron
300°C Max.
3 sec. Max.
(one time only)
LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Pre-heat
Pre-heat time
Solder wave
Soldering time
CAUTIONS
Wave soldering
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
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