HSMD-C170 Avago Technologies US Inc., HSMD-C170 Datasheet - Page 3

• Manufacturer Part Number: HSMD-C170
• Description: LED CHIP GAP ORANGE TOP MOUNT
• Manufacturer: Avago Technologies US Inc.
• Type: Uni-Colorr

Specifications of HSMD-C170

• Package / Case: 0805 (2012 Metric)
• Viewing Angle: 170°
• Color: Orange
• Millicandela Rating: 8mcd
• Current - Test: 20mA
• Wavelength - Dominant: 604nm
• Wavelength - Peak: 605nm
• Voltage - Forward (vf) Typ: 2.2V
• Lens Type: Diffused
• Lens Style/size: Rectangle, 1.4mm x 1.25mm
• Size / Dimension: 2.00mm L x 1.25mm W
• Height: 0.80mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 604nm
• Led Size: 0805
• Illumination Color: Orange
• Lens Color/style: Diffused
• Operating Voltage: 2.2 V
• Wavelength: 604 nm
• Luminous Intensity: 8 mcd
• Mounting Style: SMD/SMT
• Package Type: Chip Led
• Emitting Color: Orange
• Test Current (it): 20mA
• Forward Current: 25mA
• Dominant Wave Length: 604nm
• Forward Voltage: 2.6V
• Product Length (mm): 2mm
• Product Height (mm): 0.8mm
• Product Depth (mm): 1.25mm
• Mounting: Surface Mount
• Peak Wavelength: 605nm
• Shape Type: Rectangular
• Chip Material: GaP
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 85C
• Reverse Voltage: 5V
• Power Dissipation: 52mW
• Lens Dimensions: 1.4x1.25x0.5mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1794-2; HSMD-C170

Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
3
Package Dimensions, continued
Device Selection Guide
Footprint
(mm)
1.6 x 0.8 x 0.8
2.0 x 1.25 x 0.8
3.2 x 1.5 x 1.0
1.6 x 0.8 x 0.6
3.2 x 1.6 x 1.1
Absolute Maximum Ratings
T
Parameter
DC Forward Current
Power Dissipation
Reverse Voltage (I
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
A
(0.020 ± 0.008)
= 25°C
PC BOARD
DIFFUSED
0.50 ± 0.2
0.6 (0.024)
[1,2]
EPOXY
CATHODE LINE
R
= 100 μA)
[1,2]
AS AlInGaP
Amber
HSMA-C190
HSMA-C170
HSMA-C110
HSMA-C191
HSMA-C150
HSMx-C150
SOLDERING
3.2 (0.126 )
TERMINAL
2.0 (0.079)
0.5 (0.020)
AS AlInGaP
Orange
HSML-C190
HSML-C170
HSML-C110
HSML-C191
HSML-C150
(0.020 ± 0.008)
0.50 ± 0.2
CATHODE
MARK
1.1 (0.043)
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED
POLARITY
1.6 (0.063)
HSMx-C1xx
25
60
5
95
–40 to +85
–40 to +85
See reflow soldering profile (Figure 7 & 8)
AS AlInGaP
Red
HSMC-C190
HSMC-C170
HSMC-C110
HSMC-C191
HSMC-C150
AS AlInGaP
Red
HSMZ-C190
HSMZ-C170
HSMZ-C110
Package
Description
Untinted, Diffused
Untinted, Diffused
Untinted, Non-diffused
Untinted, Diffused
Untinted, Diffused
Units
mA
mW
V
°C
°C
°C