TLMP1100-GS08 Vishay, TLMP1100-GS08 Datasheet - Page 14

• Manufacturer Part Number: TLMP1100-GS08
• Description: LED 0603 PURE GREEN 15MCD
• Manufacturer: Vishay

Specifications of TLMP1100-GS08

• Bulb Size: 1.6mm X 0.8mm
• Luminous Intensity: 15mcd
• Viewing Angle: 160°
• Forward Voltage: 2.1V
• Led Mounting: SMD
• Lens Shape: Rectangular
• Color: Green
• Millicandela Rating: 15mcd
• Current - Test: 20mA
• Wavelength - Dominant: 558nm
• Wavelength - Peak: 555nm
• Voltage - Forward (vf) Typ: 2.1V
• Lens Type: Clear
• Lens Style/size: Rectangle, 1.6mm x 0.8mm
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 1.60mm L x 0.80mm W
• Height: 0.60mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 558nm
• Led Colour: Green
• Dominant Wavelength: 558nm
• Dominant Wavelength Max: 566nm
• Led Color: Green
• Forward Current If: 20mA
• Wavelength Typ: 566nm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 751-1176-2

TLMB1100, TLMG1100, TLMO1100, TLMP1100, TLMS1100, TLMY1100
Vishay Semiconductors
SOLDERING PROFILE
DRY PACKING
The reel is packed in an anti-humidity bag to protect
the
transportation and storage.
FINAL PACKING
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping
purposes.
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14
Figure 34. Vishay Lead (Pb)-free Reflow Soldering Profile
300
250
200
150
100
devices
50
15973
19470-4
0
0
Aluminum bag
255 °C
240 °C
217 °C
255
max. Ramp Up 3 °C/s
IR Reflow Soldering Profile for lead (Pb)-free Soldering
50
Preconditioning acc. to JEDEC Level 2
from
Reel
max. 120 s
(acc. to J-STD-020C)
100
absorbing
Time (s)
150
max. Ramp Down 6 °C/s
max. 100 s
For technical support, please contact:
200
max. 30 s
max. 2 cycles allowed
moisture
Label
max. 260 °C
250
245 °C
during
300
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the
aluminum bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity  60 % RH max.
After more than 1 year under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH
(dry air/nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device
containers or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2 label is
included on all dry bags.
Example of JESD22-A112 level 2 label
ESD PRECAUTION
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices
especially when they are removed from the antistatic
shielding bag. Electro-static sensitive devices warning
labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors
specific data.
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Document Number 83173
Rev. 2.1, 07-Feb-11
17028