B32672Z4105K000 EPCOS Inc, B32672Z4105K000 Datasheet - Page 12
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B32672Z4105K000
Manufacturer Part Number
B32672Z4105K000
Description
CAP 1.0UF 450V 10% METAL POLYPRO
Manufacturer
EPCOS Inc
Series
MKP B32672Zr
Datasheet
1.B32672Z4104K000.pdf
(22 pages)
Specifications of B32672Z4105K000
Capacitance
1.0µF
Voltage - Ac
220V
Voltage - Dc
450V
Dielectric Material
Polypropylene, Metallized
Tolerance
±10%
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
Radial
Size / Dimension
0.709" L x 0.433" W (18.00mm x 11.00mm)
Height
0.728" (18.50mm)
Termination
PC Pins
Lead Spacing
0.591" (15.00mm)
Features
AC and Pulse
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Esr (equivalent Series Resistance)
-
Other names
B32672Z4105K
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
B32672Z4105K000
Manufacturer:
TDK-EPCOS
Quantity:
30 000
Mounting guidelines
1
1.1
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
1.2
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series
MKT boxed (except 2.5
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5
MKP
MKT
Please read Cautions and warnings and
Important notes at the end of this document.
coated
uncoated (lead spacing > 10 mm)
(lead spacing
uncoated (lead spacing
insulated (B32559)
Soldering
Solderability of leads
Resistance to soldering heat
B32671Z ... B32673Z
Power Factor Correction
7.5 mm)
6.5
6.5
7.2 mm)
235 5 C
2.0 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder 90%, free-flowing solder
10 mm)
7.2 mm)
Solder bath temperature Soldering time
260 5 C
Page 12 of 22
10 1 s
5 1 s
< 4 s
recommended soldering
profile for MKT uncoated
(lead spacing
insulated (B32559)
10 mm) and