HFBR-5961LZ Avago Technologies US Inc., HFBR-5961LZ Datasheet - Page 7

• Manufacturer Part Number: HFBR-5961LZ
• Description: TXRX MMF FE SONET OC-3 2X5
• Manufacturer: Avago Technologies US Inc.

Specifications of HFBR-5961LZ

• Applications: Ethernet
• Data Rate: 155MBd
• Wavelength: 1300nm
• Voltage - Supply: 2.97 V ~ 3.63 V
• Connector Type: LC Duplex
• Mounting Type: Through Hole
• Supply Voltage: 3.3V
• Wavelength Typ: 1300nm
• Leaded Process Compatible: Yes
• Optical Fiber Type: TX/RX
• Optical Rise Time: 3/2.2ns
• Optical Fall Time: 3/2.2ns
• Jitter: 0.4/0.3ns
• Operating Temperature Classification: Commercial
• Peak Wavelength: 1308/1380nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 2.97V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.63V
• Output Current: 50mA
• Operating Temp Range: 0C to 70C
• Mounting: Snap Fit To Panel
• Pin Count: 10
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Electrostatic Discharge (ESD)
There are two design cases in which immunity to ESD
damage is important.
The first case is during handling of the transceiver prior
to mounting it on the circuit board. It is important to
use normal ESD handling precautions for ESD sensitive
devices. These precautions include using grounded
wrist straps, work benches, and floor mats in ESD con-
trolled areas.
The second case to consider is static discharges to the
exterior the equipment chassis containing the trans-
ceiver parts. To the extent that the LC connector is
exposed to the outside of the equipment chassis it may
be subject to whatever ESD system level test criteria
that the equipment is intended to meet.
NOTES:
1. THIS PAGE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT AND FRONT PANEL OPENINGS FOR SFF TRANSCEIVERS.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES ALLOWED IN KEEP-OUT AREAS.
3. THIS DRAWING SHOWS EXTRA PIN HOLES FOR 2 x 6 PIN AND 2 x 10 PIN TRANSCEIVERS. THESE EXTRA HOLES ARE NOT REQUIRED FOR HFBR-5961xxZ AND OTHER
4. HOLES FOR MOUNTING STUDS MUST NOT BE TIED TO SIGNAL GROUND BUT MAY BE TIED TO CHASSIS GROUND.
5. HOLES FOR HOUSING LEADS OPTIONAL AND NOT REQUIRED FOR HFBR-5961L/HFBR-5961G. IF NEEDED IN FUTURE, THESE HOLES MUST BE TIED TO SIGNAL
6. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 6. Recommended Board Layout Hole Pattern
7
4 x Ø
(.525)
13.34
A
2 x 5 PIN SFF MODULES.
GROUND.
(.055 ± .004)
1.40 ± .10
(.479)
12.16
SEE DETAIL B
20 x Ø
(NOTE 5)
(.039)
1.00
(.032 ± .004)
0.81 ± .10
(.140)
3.56
+ 1.50
- 0
(+.059)
(- .000)
(.620)
15.75
+ 0
- 0.75
(+.000)
(- .030)
6 7 8 9 10
5 4 3 2 1
(1.014)
25.75
(.600)
15.24
MIN. PITCH
9 X
(.280)
(.350)
(.180)
(.070)
7.11
8.89
4.57
1.78
(.299)
SEE NOTE 3
7.59
A
A
SEE DETAIL A
(.400)
10.16
(.600)
15.24
2 x Ø
(.560 ± .004)
14.22 ± .10
MIN. PITCH
(.055 ± .004)
1.40 ± .10
(NOTE 4)
Electromagnetic Interference (EMI)
Most equipment designs utilizing this high speed trans-
ceiver from Avago will be required to meet the require-
ments of FCC in the United States, CENELEC EN55022
(CISPR 22) in Europe and VCCI in Japan.
This product is suitable for use in designs ranging from
a desktop computer with a single transceiver to a con-
centrator or switch product with a large number of
transceivers.
.039
1
DETAIL B (4 x)
(.400 ± .004)
10.16 ± .10
DETAIL A (3 x)
2 x Ø
(.236)
6
(.090)
(.118)
2.29
3
.071
1.8
MAX. (AREA FOR EYELET'S)
SECTION A - A
(.118)
3
TOP OF PCB