B32231D8104K000 EPCOS Inc, B32231D8104K000 Datasheet - Page 11
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B32231D8104K000
Manufacturer Part Number
B32231D8104K000
Description
CAP .10UF 630V METAL POLY AXIAL
Manufacturer
EPCOS Inc
Series
MKT B32231r
Datasheet
1.B32231D1154K000.pdf
(19 pages)
Specifications of B32231D8104K000
Capacitance
0.1µF
Voltage - Ac
200V
Voltage - Dc
630V
Dielectric Material
Polyester, Metallized
Tolerance
±10%
Operating Temperature
-40°C ~ 100°C
Mounting Type
Through Hole
Package / Case
Axial
Size / Dimension
0.748" L x 0.236" W (19.00mm x 6.00mm)
Height
0.433" (11.00mm)
Termination
PC Pins
Features
General Purpose
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Spacing
-
Esr (equivalent Series Resistance)
-
Other names
B32231D8104K
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
B32231D8104K000
Manufacturer:
TDK-EPCOS
Quantity:
30 000
1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
max
. Long exposure to temperatures above this type-related temperature limit
Page 11 of 19
General purpose (wound)
B32231