HFBR-2521 Avago Technologies US Inc., HFBR-2521 Datasheet - Page 4

• Manufacturer Part Number: HFBR-2521
• Description: RCVR OPT HI PERF VERS LINK HORZ
• Manufacturer: Avago Technologies US Inc.

Specifications of HFBR-2521

• Data Rate: 5MBd
• Voltage - Supply: 4.75 V ~ 5.25 V
• Current - Supply: 6.2mA
• Applications: General Purpose
• Function: Designed for use in high and low volume cost assembly processes such as auto insertion and wave soldering.
• Product: Receiver
• Wavelength: 660 nm
• Diode Capacitance: 86 pF
• Maximum Output Current: 25 mA
• Operating Supply Voltage: - 0.5 V to + 7 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• For Use With: Plastic Optical Fiber
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Minimum Receivable: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Versatile Link Printed Board Layout Dimensions
Horizontal Module
TOP VIEW
Interlocked (Stacked) Assemblies
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter-
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use a
straight edge, such as a ruler, to bring all stacked units
into uniform alignment. This technique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated
stacking and unstacking causes no damage to individual
units.
Stacking Horizontal Modules
Figure 1. Interlocked (stacked) horizontal or vertical packages
4
(0.100)
DIMENSIONS IN MILLIMETERS (INCHES).
2.54
4
5
3
2
1
6
(0.300)
7.62
(0.073)
1.85
1.01 (0.040) DIA.
MIN.
(0.300)
7.62
(refer to Figure 1)
PCB EDGE
Vertical Module
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Vertical Modules