HDSP2000LP OSRAM Opto Semiconductors Inc, HDSP2000LP Datasheet - Page 7

• Manufacturer Part Number: HDSP2000LP
• Description: DISPLAY 4CHAR .15" RED
• Manufacturer: OSRAM Opto Semiconductors Inc

Specifications of HDSP2000LP

• Millicandela Rating: 200µcd
• Size / Dimension: 0.70" L x 0.35" W x 0.20" H (17.75mm x 8.89mm x 5.08mm)
• Color: Red
• Configuration: 5 x 7
• Number Of Digits: 4
• Character Size: 0.15 in
• Illumination Color: Red
• Wavelength: 655 nm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Luminous Intensity: 200 ucd
• Viewing Area (w X H): 2.11 mm x 3.71 mm
• Display Type: 5 x 7 Dot Matrix
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Forward (vf) Typ: -
• Internal Connection: -
• Lead Free Status / Rohs Status: Details
• Other names: Q68000A8131

Thermal Considerations
The small alphanumeric displays are hybrid LED and CMOS
assemblies that are designed for reliable operation in commercial,
industrial, and military environments. Optimum reliability and
optical performance will result when the junction temperature of the
LEDs and CMOS ICs are kept as low as possible.
Thermal Modeling
HSDP200XLP consist of two driver ICs and four 5 x 7 LED
matrixes. A thermal model of the display is shown in Figure
„Thermal Model“. It illustrates that the junction temperature of the
semiconductor = junction self heating + the case temperature rise
+ the ambient temperature.
Equation 1 shows this relationship.
Thermal Model
See Equation 1 below.
The junction rise within the LED is the product of the thermal
impedance of an individual LED (37°C/W, DF=20%, F=200 Hz),
times the forward voltage, V
13 – 14.5 mA. This rise averages T
shows the V
Model Number
The junction rise within the LED driver IC is the combination of the
power dissipated by the IC quiescent current and the 28 row driver
current sinks. The IC junction rise is given in Equation 2.
A thermal resistance of 28°C/W results in a typical junction rise of
6°C.
See Equation 2 below.
Equation 1.
Equation 2.
2009-03-31
T
HDSP2000LP
HSDP2001/2/3LP
T
LED Power
J LED
J IC
LED
T J LED
T
(
(
R
J IC
θ
(
(
1
T
)
1
)
=
)
=
F(LED)
=
[
)
IC Power
5 V
P
IC
=
P
R
(
LED
θ2
COL
T
for the respective displays.
[
2
COL
(
I COL 28
Z
(
LED Power
R
θJ C
VF
Min.
1.6
1.9
LED
–
θJC
R
V
⁄
θ1
F(LED)
F LED
T
+
1
(
+
)V F LED
P
R
CASE
, and forward current I
LED Power
R
θCA
LED
HDSP2000LP, HDSP2001LP, HDSP2002LP, HDSP2003LP
θ
(
CA
R
J(LED)
)
θ
)
Typ.
1.7
2.2
1
T
⋅
)
1
(
(
=1°C. The Table below
+
I
R
) Z θJC
COL
T
θJC
IC Power
A
IC
R
θ
+
T
2 ⁄
2
2
R
]
)
+
θCA
Max.
2.0
3.0
⋅
[
(
LED Power
F
(
n 35
(LED), of
LED
n 35
) T
⁄
R
+
⁄
IDDG5321
1 θ
T
)DF
1
A
)I COL DF 5V COL
+
7
V
For ease of calculations the maximum allowable electrical operat-
ing condition is dependent upon the aggregate thermal resistance
of the LED matrixes and the two driver ICs. All of the thermal man-
agement calculations are based upon the parallel combination of
these two networks which is 15°C/W. Maximum allowable power
dissipation is given in Equation 3.
Equation 3.
For further reference see Figures „Maximum Allowable Power Dis-
sipation vs. Temperature“ (page 3) and Figures from page 8 on.
Key to equation symbols
DF
I
I
n
P
P
P
P
R
R
T
T
T
T
V
V
V
Z
CC
COL
CC
A
J(IC)
J(LED)
J(MAX)
qJC
CASE
COL
DISPLAY
LED
CC
COL
F(LED)
P DISPLAY
qCA
qJC
P
DISPLAY
(
⋅
I
CC
]
⋅
[
R
)
=
=
Duty factor
Quiescent IC current
Column current
Number of LEDs on in a 5 x 7 array
Package power dissipation excluding LED
under consideration
Power dissipation of a column
Power dissipation of the display
Power dissipation of a LED
Thermal resistance case to ambient
Thermal resistance junction to case
Ambient temperature
Junction temperature of an IC
Junction temperature of a LED
Maximum junction temperature
IC voltage
Column voltage
Forward voltage of LED
Thermal impedance junction to case
+
θJC
V CC I CC
T J MAX
--------------------------------------- -
R
5V
θJC
+
(
COL
R
θCA
+
R
) T A
I
]
θCA
COL
–
⋅
]
[
+
R θJC
T
A
(
n 35
⁄
+
R θCA
) DF
+
]
+
V
T A
CC
I
CC