B32231D1154K000 EPCOS Inc, B32231D1154K000 Datasheet - Page 11

• Manufacturer Part Number: B32231D1154K000
• Description: CAP .15UF 100V METAL POLY AXIAL
• Manufacturer: EPCOS Inc
• Series: MKT B32231r

Specifications of B32231D1154K000

• Capacitance: 0.15µF
• Voltage - Ac: 63V
• Voltage - Dc: 100V
• Dielectric Material: Polyester, Metallized
• Tolerance: ±10%
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Through Hole
• Package / Case: Axial
• Size / Dimension: 0.551" L x 0.217" W (14.00mm x 5.50mm)
• Height: 0.335" (8.50mm)
• Termination: PC Pins
• Features: General Purpose
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Esr (equivalent Series Resistance): -
• Other names: B32231D1154K

1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
max
. Long exposure to temperatures above this type-related temperature limit
Page 11 of 19
General purpose (wound)
B32231