HDSM-283F Avago Technologies US Inc., HDSM-283F Datasheet - Page 8

DISPLAY 1DIGIT YLW CC 0.28"

HDSM-283F

Manufacturer Part Number
HDSM-283F
Description
DISPLAY 1DIGIT YLW CC 0.28"
Manufacturer
Avago Technologies US Inc.
Type
Moduler
Datasheet

Specifications of HDSM-283F

Number Of Digits/alpha
1
Size / Dimension
0.43" L x 0.30" W x 0.15" H (10.80mm x 7.50mm x 3.75mm)
Digit/alpha Size
0.28" (7.11mm)
Display Type
7-Segment
Common Pin
Common Cathode
Color
Yellow
Voltage - Forward (vf) Typ
2.1V
Current - Test
10mA
Millicandela Rating
8mcd
Wavelength - Peak
591nm
Power Dissipation (max)
65mW
Package / Case
10.00mm L x 7.50mm W x 3.75mm H
No. Of Digits / Alpha
1
Character Size
7mm
Led Color
Yellow
Common Connection
Common Cathode
Luminous Intensity
8mcd
Forward Current If
20mA
Forward Voltage
2.1V
Number Of Digits
1
Illumination Color
Yellow
Wavelength
632 nm / 634 nm
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Package Type
SMD
Product Length (mm)
7.5mm
Product Height (mm)
3.75mm
Product Depth (mm)
10.8mm
Digit Size (in)
.28in
Character Displayed
Numeric
Viewing Area Length (mm)
4.6mm
Viewing Area Height (mm)
7mm
Emitting Color
Yellow
Test Current (it)
10mA
Forward Current
25mA
Dominant Wave Length
589nm
Power Dissipation
65mW
Total Thickness
3.15mm
Reverse Voltage
5V
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Pin Count
11
Configuration
Common Cathode
Number Of Elements
9
Peak Wavelength
591nm
Reverse Current
100uA
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Intensity Bin Limits (mcd)
Yellow / Red / Orange / Green
Tolerance: ±15%
Notes:
1. Bin categories are established for classification of products. Prod-
SMT Soldering Profile
Pb free reflow soldering Profile
Notes:
1. The peak temperature refers to the peak package body tempera-
2. Number of reflow process shall be limited to maximum 2 times only.
8
IV Bin Category
L
M
N
P
ucts may not be available in all categories. Please contact your
Avago representative for information on currently available bins.
ture.
Cooling process to normal temperature is required between first
and second soldering process.
217°C
200°C
150°C
3°C/SEC. MAX.
3°C/SEC. MAX.
60 - 120 SEC.
Min.
3.401
5.401
8.601
13.701
250°C
TIME
(Acc. to J-STD-020C)
10 - 30 SEC.
100 SEC. MAX.
Max
5.400
8.600
13.700
21.800
6°C/SEC. MAX.
Recommended soldering pattern (unit: mm)
Recommended stencil window opening is 80%
3
0.8
1.27 x 5 = 6.35
7.8

Related parts for HDSM-283F