MT16HTF25664HY-667E1 Micron Technology Inc, MT16HTF25664HY-667E1 Datasheet - Page 8

MODULE DDR2 2GB 200-SODIMM

MT16HTF25664HY-667E1

Manufacturer Part Number
MT16HTF25664HY-667E1
Description
MODULE DDR2 2GB 200-SODIMM
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT16HTF25664HY-667E1

Memory Type
DDR2 SDRAM
Memory Size
2GB
Speed
667MT/s
Package / Case
200-SODIMM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1345
Electrical Specifications
Table 7: Absolute Maximum Ratings
PDF: 09005aef818e4054
htf16c128_256x64h.pdf - Rev. D 3/10 EN
V
Symbol
IN
I
V
VREF
T
, V
I
T
OZ
I
DD
C
A
I
1
OUT
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
V
pins not under test = 0V)
Output leakage current; 0V ≤ V
ODT are disabled
V
Module ambient operating temperature
DDR2 SDRAM component operating tem-
perature
DD
DD
REF
; V
supply voltage relative to V
leakage current; V
REF
Notes:
2
input 0V ≤ V
Stresses greater than those listed may cause permanent damage to the module. This is a
stress rating only, and functional operation of the module at these or any other condi-
tions outside those indicated in the device data sheet are not implied. Exposure to
absolute maximum rating conditions for extended periods may adversely affect reliability.
1. The refresh rate is required to double when T
2. For further information, refer to technical note TN-00-08: "Thermal Applications," avail-
able on Micron’s Web site.
IN
REF
≤ 0.95V; (All other
= valid V
OUT
SS
SS
1GB, 2GB (x64, DR) 200-Pin DDR2 SDRAM SODIMM
; DQ and
REF
level
IN
Address inputs, RAS#, CAS#,
WE#
S#, CKE, ODT, CK, CK#
DM
DQ, DQS, DQS#
Commercial
Industrial
Commercial
Industrial
8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
C
exceeds 85°C.
Electrical Specifications
Min
–1.0
–0.5
–80
–40
–10
–10
–32
–40
–40
0
0
© 2004 Micron Technology, Inc. All rights reserved.
Max
2.3
2.3
80
40
10
10
32
70
85
85
95
Units
µA
µA
µA
°C
°C
°C
°C
V
V

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