MT4VDDT1664HY-335F3 Micron Technology Inc, MT4VDDT1664HY-335F3 Datasheet - Page 6
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MT4VDDT1664HY-335F3
Manufacturer Part Number
MT4VDDT1664HY-335F3
Description
MODULE DDR 128MB 200-SODIMM
Manufacturer
Micron Technology Inc
Specifications of MT4VDDT1664HY-335F3
Memory Type
DDR SDRAM
Memory Size
128MB
Speed
200MHz
Package / Case
200-SODIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
200SODIMM
Device Core Size
64b
Organization
16Mx64
Total Density
128MByte
Chip Density
256Mb
Access Time (max)
700ps
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Operating Current
880mA
Number Of Elements
4
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1344
General Description
Serial Presence-Detect Operation
PDF: 09005aef837131bb/Source: 09005aef8086ea0b
dd4c16_32x64h.fm - Rev. E 10/08 EN
The MT4VDDT1664H and MT4VDDT3264H are high-speed, CMOS dynamic random
access 128MB and 256MB memory modules organized in a x64 configuration. These
modules use DDR SDRAM devices with four internal banks.
DDR SDRAM modules use a double data rate architecture to achieve high-speed opera-
tion. The double data rate architecture is essentially a 2n-prefetch architecture with an
interface designed to transfer two data words per clock cycle at the I/O pins. A single
read or write access for DDR SDRAM modules effectively consists of a single
2n-bit-wide, one-clock-cycle data transfer at the internal DRAM core and two corre-
sponding n-bit-wide, one-half-clock-cycle data transfers at the I/O pins.
A bidirectional data strobe (DQS) is transmitted externally, along with data, for use in
data capture at the receiver. DQS is an intermittent strobe transmitted by the DDR
SDRAM during READs and by the memory controller during WRITEs. DQS is edge-
aligned with data for READs and center-aligned with data for WRITEs.
DDR SDRAM modules operate from differential clock inputs (CK and CK#); the crossing
of CK going HIGH and CK# going LOW will be referred to as the positive edge of CK.
Control, command, and address signals are registered at every positive edge of CK. Input
data is registered on both edges of DQS, and output data is referenced to both edges of
DQS, as well as to both edges of CK.
DDR SDRAM modules incorporate serial presence-detect. The SPD data is stored in a
256-byte EEPROM. The first 128 bytes are programmed by Micron to identify the module
type and various DDR SDRAM organizations and timing parameters. The remaining 128
bytes of storage are available for use by the customer. System READ/WRITE operations
between the master (system logic) and the slave EEPROM device occur via a standard
I
which provide eight unique DIMM/EEPROM addresses. Write protect (WP) is connected
to Vss, permanently disabling hardware write protect.
2
C bus using the DIMM’s SCL (clock) and SDA (data) signals, together with SA[2:0],
128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM
6
Micron Technology, Inc., reserves the right to change products or specifications without notice.
General Description
©2003 Micron Technology, Inc. All rights reserved.