MT18HTF12872FY-667D5E3 Micron Technology Inc, MT18HTF12872FY-667D5E3 Datasheet
MT18HTF12872FY-667D5E3
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MT18HTF12872FY-667D5E3 Summary of contents
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DDR2 SDRAM FBDIMM MT18HTF12872F – 1GB MT18HTF25672F – 2GB For the latest data sheets and technical notes, refer to Micron’s Web site: Features • 240-pin, DDR2 fully buffered dual in-line memory module (FBDIMM) • Fast data transfer rates: PC2-4200, PC2-5300, ...
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... Row address Column address Module rank address Table 3: Part Numbers and Timing Parameters – 1GB Base device: MT47H128M4, 2 Part Number MT18HTF12872FY-80E__ MT18HTF12872FY-667__ MT18HTF12872FY-53E__ Table 4: Part Numbers and Timing Parameters – 2GB Base device: MT47H256M4, 2 Part Number MT18HTF25672FY-80E__ MT18HTF25672FY-667__ MT18HTF25672FY-53E__ Notes: 1. Data sheets for the base devices can be found on Micron’s Web site. ...
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Pin Assignments and Descriptions Table 5: Pin Assignments 240-Pin FBDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol PN3 PN3 ...
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Table 6: Pin Descriptions Symbol Type Description PS0–PS9 Input Primary southbound data, positive lines. PS0#–PS9# Input Primary southbound data, negative lines. SCL Input Serial presence-detect (SPD) clock input. SCK Input System clock input, positive line. SCK# Input System clock Input, ...
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... Micron Technology, Inc., reserves the right to change products or specifications without notice. 5 Block Diagrams Commodity DDR2 DDR2 SDRAM component devices DDR2 component DDR2 component DDR2 component Up to eight modules AMB • • • DDR2 component DDR2 component DDR2 component DDR2 component SMBus access to buffer registers ©2005 Micron Technology, Inc. All rights reserved. ...
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Functional Block Diagram Figure 3: Functional Block Diagram V SS CS0# DQS0 DQS0# DQ0 DQ1 DQ2 DQ3 DQS9 DQS9# DQ4 DQ5 DQ6 DQ7 DQS1 DQS1# DQ8 DQ9 DQ10 DQ11 DQS10 DQS10# DQ12 DQ13 DQ14 DQ15 DQS2 DQS2# DQ16 DQ17 DQ18 ...
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... Serial Presence-Detect (SPD) for Fully Buffered DIMM – JEDEC Standard No. 21-C page 4.1.2.7-1 The MT18HTF12872F and MT18HTF25672F DDR2 SDRAM modules are a high-band- width, large-capacity channel solution that have a narrow host interface. FBDIMMs use DDR2 SDRAM devices isolated from the channel behind an AMB buffer on the FBDIMM ...
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Electrical Specifications Stresses greater than those listed in Table 7 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in the ...
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I Conditions and Specifications DD Table 10: I Conditions DD Symbol Condition I _Idle_0 Idle current, single, or last DIMM: L0 state; Idle (0 percent bandwidth); Primary channel DD enabled; Secondary channel disabled; CKE HIGH; Command and address lines stable; ...
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Table 14: I Specifications – 2GB DDR2-533 DD Symbol I _Idle_0 2,200 CC I 1,620 DD 6.5 Total power Table 15: I Specifications – 2GB DDR2-667 DD Symbol I _Idle_0 2,600 CC ...
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Serial Presence-Detect Table 17: Serial Presence-Detect EEPROM DC Operating Conditions Parameter/Condition Supply voltage Input high voltage: logic 1; all inputs Input low voltage: logic 0; all inputs Output low voltage 3mA OUT Input leakage current GND ...
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Table 19: Serial Presence-Detect Matrix – SDRAM Device and Module Byte Description 0 CRC range SPD bytes total Bytes used 1 SPD revision 2 Key byte/DRAM device type 3 Voltage levels of this assembly 4 SDRAM addressing: Device rows/columns/banks 5 ...
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Table 19: Serial Presence-Detect Matrix – SDRAM Device and Module (continued) Byte Description Bits 7:4: ΔT 33 (MAX) (DRAM case temperature difference between C MAX case temperature and baseline MAX case temperature), the baseline MAX case temperature is 85°C; Bits ...
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Table 20: Serial Presence-Detect – AMB and CRC Byte Description 80 FBDIMM reserved byte 81 Channel protocol supported (lower byte) 82 Channel protocol supported (upper byte) 83 Back-to-back turnaround clock cycles t 84 Buffer read access at CK for MAX ...
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Table 20: Serial Presence-Detect – AMB and CRC (continued) Byte Description 114 AMB postinitialization bytes 115 AMB manufacturer’s ID code (lower byte) 116 AMB manufacturer’s ID code (upper byte) 126–127 CRC for bytes 0–116, 1GB/2GB 150 Informal AMB revision tag ...
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Module Dimensions Figure 4: 240-Pin DDR2 FBDIMM 0.5 (0.02) R (4X) 1.5 (0.059 (4X) 2.60 (0.102) D (2X) 5.2 (0.205) TYP 1.25 (0.0492) Pin 1 TYP 1.0 (0.039) TYP 9.9 (0.39) TYP 5.48 (0.216) (4X) TYP 3.1 ...